Lens assembly and electronic device including same

ABSTRACT

A lens assembly is provided. The lens assembly includes lenses arranged along a direction of a first optical axis from an object side, an image sensor receiving light guided through the lenses, the image sensor includes an imaging surface inclined with respect to the first optical axis, a first optical member disposed between the lenses and the image sensor, the first optical member receiving light incident through the lenses in a direction of the first optical axis and emitting the light along a direction of a second optical axis crossing the first optical axis, and a second optical member disposed between the first optical member and the image sensor, the second optical member receiving light through the first optical member in the direction of the second optical axis and emitting the light to the image sensor along a direction of a third optical axis crossing the second optical axis.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation application, claiming priority under§ 365(c), of an International application No. PCT/KR2023/000385, filedon Jan. 9, 2023, which is based on and claims the benefit of a Koreanpatent application number filed on May 26, 2022, in the KoreanIntellectual Property Office, and of a Korean patent application number10-2022-0117071, filed on Sep. 16, 2022, in the Korean IntellectualProperty Office, the disclosure of each of which is incorporated byreference herein in its entirety.

TECHNICAL FIELD

The disclosure relates to an electronic device, for example, a lensassembly and an electronic device including the same.

BACKGROUND ART

Typically, an electronic device may mean a device that performs apredetermined function according to a program provided therein (e.g., anelectronic scheduler, a portable multimedia reproducer, a mobilecommunication terminal, a tablet personal computer (PC), an image/sounddevice, a desktop/laptop PC, and/or a vehicle navigation system), aswell as a home appliance. The above-mentioned electronic devices mayoutput, for example, information stored therein as sound or an image.With an increase of a degree of integration of the electronic devicesand the generalization of ultra-high-speed and high-capacity wirelesscommunication, recently, a single electronic device, such as a mobilecommunication terminal, may be provided with various functions. Forexample, various functions, such as an entertainment function such as agame, a multimedia function such as music/video playback, acommunication and security function for mobile banking or the like,and/or a schedule management or e-wallet function, are integrated in asingle electronic device, in addition to a communication function.

With the development of digital camera manufacturing technology,electronic devices equipped with downsized and lightened camera moduleshave been commercialized. As an electronic device that is generallycarried at all times (e.g., a mobile communication terminal) is equippedwith a camera module, it becomes possible for a user to easily utilizevarious functions such as video call and/or augmented reality as well asto take a picture or video.

In recent years, electronic devices including a plurality of camerashave been distributed. An electronic device may include, for example, acamera module including a wide-angle camera and a telephoto camera. Theelectronic device may acquire a wide-angle image by photographing awide-range scene around the electronic device by using the wide-anglecamera, or may acquire a telephoto image by photographing a scenecorresponding to a location relatively far from the electronic device byusing the telephoto camera. In this way, by including a plurality ofcamera modules and/or lens assemblies, downsized electronic devices suchas smartphones are making inroads into the compact camera market, andare expected to replace high-performance cameras such as single-lensreflex cameras in the future.

The above information is presented as background information only toassist with an understanding of the disclosure. No determination hasbeen made, and no assertion is made, as to whether any of the abovemight be applicable as prior art with regard to the disclosure.

DETAILED DESCRIPTION OF THE INVENTION Technical Solution

Aspects of the disclosure are to address at least the above-mentionedproblems and/or disadvantages and to provide at least the advantagesdescribed below. Accordingly, an aspect of the disclosure is to providea lens assembly and an electronic device including the same.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

In accordance with an aspect of the disclosure, a lens assembly isprovided. The lens assembly includes at least two lenses arranged alonga direction of a first optical axis from an object side, an image sensorconfigured to receive light guided and/or focused through the at leasttwo lenses, wherein the image sensor includes an imaging surfacedisposed to be inclined with respect to the first optical axis, a firstoptical member disposed between the at least two lenses and the imagesensor, wherein the first optical member is configured to receive lightincident through the at least two lenses in a direction of the firstoptical axis and to emit the light along a direction of a second opticalaxis crossing the first optical axis, and a second optical memberdisposed between the first optical member and the image sensor, whereinthe second optical member is configured to receive light incidentthrough the first optical member in the direction of the second opticalaxis and to emit the light to the image sensor along a direction of athird optical axis crossing the second optical axis. In an embodiment,the lens assembly may satisfy a conditional expression“0.1<=TTL/f<=0.35”, wherein “TTL” is a length from an object-sidesurface of a first lens on the object side to a sensor-side surface of afirst lens on the image sensor side, “f” is a focal length of the lensassembly. In an embodiment, the lens assembly may satisfy a conditionalexpression “15<=Ang-min<=40,” wherein “Ang-min” is the smallest angleamong angles formed by two adjacent surfaces of the second opticalmember.

In accordance with another aspect of the disclosure, an electronicdevice is provided. The electronic device includes a lens assembly and aprocessor configured to acquire an image by receiving external light byusing the lens assembly. In an embodiment, the lens assembly may includeat least two lenses arranged along a direction of a first optical axisfrom an object side, an image sensor configured to receive light guidedand/or focused through the at least two lenses, wherein the image sensorincludes an imaging surface disposed to be inclined with respect to thefirst optical axis, a first optical member disposed between the at leasttwo lenses and the image sensor, wherein the first optical member isconfigured to receive light incident through the at least two lenses ina direction of the first optical axis and to emit the light along adirection of a second optical axis crossing the first optical axis, anda second optical member disposed between the first optical member andthe image sensor, wherein the second optical member is configured toreceive light incident through the first optical member in the directionof the second optical axis and to emit the light to the image sensoralong a direction of a third optical axis crossing the second opticalaxis. In an embodiment, the lens assembly may satisfy a conditionalexpression “0.1<=TTL/f<=0.35”, wherein “TTL” is a length from anobject-side surface of a first lens on the object side to a sensor-sidesurface of a first lens on the image sensor side, “f” is a focal lengthof the lens assembly. In an embodiment, the lens assembly describedabove may satisfy a conditional expression “5<=FoV<=35,” wherein “FoV”is the field of view of the lens assembly.

Other aspects, advantages, and salient features of the disclosure willbecome apparent to those skilled in the art from the following detaileddescription, which, taken in conjunction with the annexed drawings,discloses various embodiments of the disclosure.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages certainembodiments of the disclosure will be more apparent from the followingdescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a block diagram illustrating an electronic device within anetwork environment according to an embodiment of the disclosure;

FIG. 2 is a perspective view illustrating a front surface of anelectronic device according to an embodiment of the disclosure;

FIG. 3 is a perspective view illustrating a rear surface of anelectronic device of FIG. 2 according to an embodiment of thedisclosure;

FIG. 4 is an exploded perspective view illustrating an electronic deviceillustrated in FIG. 2 according to an embodiment of the disclosure;

FIG. 5 is a plan view illustrating a rear surface of an electronicdevice according to an embodiment of the disclosure;

FIG. 6 is a cross-sectional view of a portion of an electronic devicetaken along line A-A′ of FIG. 5 according to an embodiment of thedisclosure;

FIG. 7 is a configuration view exemplifying an optical path of a cameramodule in an electronic device according to an embodiment of thedisclosure;

FIG. 8 is a view illustrating a lens assembly according to an embodimentof the disclosure;

FIG. 9 is a view illustrating a second optical member of the lensassembly of FIG. 8 according to an embodiment of the disclosure;

FIG. 10 is a graph showing spherical aberration of the lens assembly ofFIG. 8 according to an embodiment of the disclosure;

FIG. 11 is a graph showing astigmatism of the lens assembly of FIG. 8according to an embodiment of the disclosure;

FIG. 12 is a graph showing distortion rate of the lens assembly of FIG.8 according to an embodiment of the disclosure;

FIG. 13 is a view illustrating a lens assembly according to anembodiment of the disclosure;

FIG. 14 is a graph showing spherical aberration of the lens assembly ofFIG. 13 according to an embodiment of the disclosure;

FIG. 15 is a graph showing astigmatism of the lens assembly of FIG. 13according to an embodiment of the disclosure;

FIG. 16 is a graph showing distortion rate of the lens assembly of FIG.13 according to an embodiment of the disclosure;

FIG. 17 is a view illustrating a lens assembly according to anembodiment of the disclosure;

FIG. 18 is a graph showing spherical aberration of the lens assembly ofFIG. 17 according to an embodiment of the disclosure;

FIG. 19 is a graph showing astigmatism of the lens assembly of FIG. 17according to an embodiment of the disclosure;

FIG. 20 is a graph showing distortion rate of the lens assembly of FIG.17 according to an embodiment of the disclosure;

FIG. 21 is a view illustrating a lens assembly according to anembodiment of the disclosure;

FIG. 22 is a graph showing spherical aberration of the lens assembly ofFIG. 21 according to an embodiment of the disclosure;

FIG. 23 is a graph showing astigmatism of the lens assembly of FIG. 21according to an embodiment of the disclosure;

FIG. 24 is a graph showing distortion rate of the lens assembly of FIG.21 according to an embodiment of the disclosure;

FIG. 25 is a view illustrating a lens assembly according to anembodiment of the disclosure;

FIG. 26 is a graph showing spherical aberration of the lens assembly ofFIG. 25 according to an embodiment of the disclosure;

FIG. 27 is a graph showing astigmatism of the lens assembly of FIG. 25according to an embodiment of the disclosure;

FIG. 28 is a graph showing distortion rate of the lens assembly of FIG.25 according to an embodiment of the disclosure;

FIG. 29 is a view illustrating a lens assembly according to anembodiment of the disclosure;

FIG. 30 is a graph showing spherical aberration of the lens assembly ofFIG. 29 according to an embodiment of the disclosure;

FIG. 31 is a graph showing astigmatism of the lens assembly of FIG. 29according to an embodiment of the disclosure; and

FIG. 32 is a graph showing distortion rate of the lens assembly of FIG.29 according to an embodiment of the disclosure.

Throughout the drawings, like reference numerals will be understood torefer to like parts, components, and structures.

MODE FOR CARRYING OUT THE INVENTION

The following description with reference to the accompanying drawings isprovided to assist in a comprehensive understanding of variousembodiments of the disclosure as defined by the claims and theirequivalents. It includes various specific details to assist in thatunderstanding but these are to be regarded as merely exemplary.Accordingly, those of ordinary skill in the art will recognize thatvarious changes and modifications of the various embodiments describedherein can be made without departing from the scope and spirit of thedisclosure. In addition, descriptions of well-known functions andconstructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are notlimited to the bibliographical meanings, but, are merely used by theinventor to enable a clear and consistent understanding of thedisclosure. Accordingly, it should be apparent to those skilled in theart that the following description of various embodiments of thedisclosure is provided for illustration purpose only and not for thepurpose of limiting the disclosure as defined by the appended claims andtheir equivalents.

It is to be understood that the singular forms “a,” “an,” and “the”include plural referents unless the context clearly dictates otherwise.Thus, for example, reference to “a component surface” includes referenceto one or more of such surfaces.

As electronic devices become smaller and lighter, the electronic devicesmay be more convenient to carry. In an environment where a display isenlarged so that a larger screen can be enjoyed even in a portableelectronic device, the electronic device may be downsized and lightenedby reducing the thickness thereof. In a downsized electronic device, itmay be difficult to mount a lens assembly having good opticalperformance. For example, the larger the number or size of lenses, theeasier it is to secure the optical performance of a lens assembly.However, in a downsized electronic device, the degree of freedom indesign may be reduced in the arrangement of the lens(es) or an imagesensor.

An embodiment of the disclosure is for solving at least theabove-mentioned problems and/or disadvantages and providing at least thefollowing advantages, and is able to provide a lens assembly havingimproved degree of freedom in design and/or an electronic deviceincluding the same.

An embodiment of the disclosure is able to provide a lens assembly thatis capable of being easily disposed in a narrow space and/or anelectronic device including the same.

The technical problems to be addressed by the disclosure are not limitedto those described above, and other technical problems, which are notdescribed above, may be clearly understood from the followingdescription by a person ordinarily skilled in the related art, to whichthe disclosure belongs.

FIG. 1 is a block diagram illustrating an electronic device in a networkenvironment according to an embodiment of the disclosure.

Referring to FIG. 1 , an electronic device 101 in a network environment100 may communicate with an electronic device 102 via a first network198 (e.g., a short-range wireless communication network), or at leastone of an electronic device 104 or a server 108 via a second network 199(e.g., a long-range wireless communication network). According to anembodiment, the electronic device 101 may communicate with theelectronic device 104 via the server 108. According to an embodiment,the electronic device 101 may include a processor 120, memory 130, aninput module 150, a sound output module 155, a display module 160, anaudio module 170, a sensor module 176, an interface 177, a connectingterminal 178, a haptic module 179, a camera module 180, a powermanagement module 188, a battery 189, a communication module 190, asubscriber identification module (SIM) 196, or an antenna module 197. Insome embodiments, at least one of the components (e.g., the connectingterminal 178) may be omitted from the electronic device 101, or one ormore other components may be added in the electronic device 101. In someembodiments, some of the components (e.g., the sensor module 176, thecamera module 180, or the antenna module 197) may be implemented as asingle component (e.g., the display module 160).

The processor 120 may execute, for example, software (e.g., a program140) to control at least one other component (e.g., a hardware orsoftware component) of the electronic device 101 coupled with theprocessor 120, and may perform various data processing or computation.According to an embodiment, as at least part of the data processing orcomputation, the processor 120 may store a command or data received fromanother component (e.g., the sensor module 176 or the communicationmodule 190) in volatile memory 132, process the command or the datastored in the volatile memory 132, and store resulting data innon-volatile memory 134. According to an embodiment, the processor 120may include a main processor 121 (e.g., a central processing unit (CPU)or an application processor (AP)), or an auxiliary processor 123 (e.g.,a graphics processing unit (GPU), a neural processing unit (NPU), animage signal processor (ISP), a sensor hub processor, or a communicationprocessor (CP)) that is operable independently from, or in conjunctionwith, the main processor 121. For example, when the electronic device101 includes the main processor 121 and the auxiliary processor 123, theauxiliary processor 123 may be adapted to consume less power than themain processor 121, or to be specific to a specified function. Theauxiliary processor 123 may be implemented as separate from, or as partof the main processor 121.

The auxiliary processor 123 may control, for example, at least some offunctions or states related to at least one component (e.g., the displaymodule 160, the sensor module 176, or the communication module 190)among the components of the electronic device 101, instead of the mainprocessor 121 while the main processor 121 is in an inactive (e.g.,sleep) state, or together with the main processor 121 while the mainprocessor 121 is in an active (e.g., executing an application) state.According to an embodiment, the auxiliary processor 123 (e.g., an imagesignal processor or a communication processor) may be implemented aspart of another component (e.g., the camera module 180 or thecommunication module 190) functionally related to the auxiliaryprocessor 123. According to an embodiment, the auxiliary processor 123(e.g., the neural processing unit) may include a hardware structurespecified for artificial intelligence model processing. An artificialintelligence model may be generated by machine learning. Such learningmay be performed, e.g., by the electronic device 101 where theartificial intelligence model is performed or via a separate server(e.g., the server 108). Learning algorithms may include, but are notlimited to, e.g., supervised learning, unsupervised learning,semi-supervised learning, or reinforcement learning. The artificialintelligence model may include a plurality of artificial neural networklayers. The artificial neural network may be a deep neural network(DNN), a convolutional neural network (CNN), a recurrent neural network(RNN), a restricted Boltzmann machine (RBM), a deep belief network(DBN), a bidirectional recurrent deep neural network (BRDNN), deepQ-network or a combination of two or more thereof but is not limitedthereto. The artificial intelligence model may, additionally oralternatively, include a software structure other than the hardwarestructure.

The memory 130 may store various data used by at least one component(e.g., the processor 120 or the sensor module 176) of the electronicdevice 101. The various data may include, for example, software (e.g.,the program 140) and input data or output data for a command relatedthereto. The memory 130 may include the volatile memory 132 or thenon-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and mayinclude, for example, an operating system (OS) 142, middleware 144, oran application 146.

The input module 150 may receive a command or data to be used by anothercomponent (e.g., the processor 120) of the electronic device 101, fromthe outside (e.g., a user) of the electronic device 101. The inputmodule 150 may include, for example, a microphone, a mouse, a keyboard,a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The sound output module 155 may output sound signals to the outside ofthe electronic device 101. The sound output module 155 may include, forexample, a speaker or a receiver. The speaker may be used for generalpurposes, such as playing multimedia or playing record. The receiver maybe used for receiving incoming calls. According to an embodiment, thereceiver may be implemented as separate from, or as part of the speaker.

The display module 160 may visually provide information to the outside(e.g., a user) of the electronic device 101. The display module 160 mayinclude, for example, a display, a hologram device, or a projector andcontrol circuitry to control a corresponding one of the display,hologram device, and projector. According to an embodiment, the displaymodule 160 may include a touch sensor adapted to detect a touch, or apressure sensor adapted to measure the intensity of force incurred bythe touch.

The audio module 170 may convert a sound into an electrical signal andvice versa. According to an embodiment, the audio module 170 may obtainthe sound via the input module 150, or output the sound via the soundoutput module 155 or an external electronic device (e.g., an electronicdevice 102 (e.g., a speaker or a headphone)) directly or wirelesslycoupled with the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power ortemperature) of the electronic device 101 or an environmental state(e.g., a state of a user) external to the electronic device 101, andthen generate an electrical signal or data value corresponding to thedetected state. According to an embodiment, the sensor module 176 mayinclude, for example, a gesture sensor, a gyro sensor, an atmosphericpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a proximity sensor, a color sensor, an infrared (IR) sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 177 may support one or more specified protocols to be usedfor the electronic device 101 to be coupled with the external electronicdevice (e.g., the electronic device 102) directly or wirelessly.According to an embodiment, the interface 177 may include, for example,a high definition multimedia interface (HDMI), a universal serial bus(USB) interface, a secure digital (SD) card interface, or an audiointerface.

A connecting terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the externalelectronic device (e.g., the electronic device 102). According to anembodiment, the connecting terminal 178 may include, for example, anHDMI connector, a USB connector, an SD card connector, or an audioconnector (e.g., a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or a movement) or electrical stimulus whichmay be recognized by a user via his tactile sensation or kinestheticsensation. According to an embodiment, the haptic module 179 mayinclude, for example, a motor, a piezoelectric element, or an electricstimulator.

The camera module 180 may capture a still image or moving images.According to an embodiment, the camera module 180 may include one ormore lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to theelectronic device 101. According to an embodiment, the power managementmodule 188 may be implemented as at least part of, for example, a powermanagement integrated circuit (PMIC).

The battery 189 may supply power to at least one component of theelectronic device 101. According to an embodiment, the battery 189 mayinclude, for example, a primary cell which is not rechargeable, asecondary cell which is rechargeable, or a fuel cell.

The communication module 190 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 101 and the external electronic device (e.g., theelectronic device 102, the electronic device 104, or the server 108) andperforming communication via the established communication channel. Thecommunication module 190 may include one or more communicationprocessors that are operable independently from the processor 120 (e.g.,the application processor (AP)) and supports a direct (e.g., wired)communication or a wireless communication. According to an embodiment,the communication module 190 may include a wireless communication module192 (e.g., a cellular communication module, a short-range wirelesscommunication module, or a global navigation satellite system (GNSS)communication module) or a wired communication module 194 (e.g., a localarea network (LAN) communication module or a power line communication(PLC) module). A corresponding one of these communication modules maycommunicate with the external electronic device via the first network198 (e.g., a short-range communication network, such as Bluetooth™,wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA))or the second network 199 (e.g., a long-range communication network,such as a legacy cellular network, a 5^(th) generation (5G) network, anext-generation communication network, the Internet, or a computernetwork (e.g., LAN or wide area network (WAN)). These various types ofcommunication modules may be implemented as a single component (e.g., asingle chip), or may be implemented as multi components (e.g., multichips) separate from each other. The wireless communication module 192may identify or authenticate the electronic device 101 in acommunication network, such as the first network 198 or the secondnetwork 199, using subscriber information (e.g., international mobilesubscriber identity (IMSI)) stored in the subscriber identificationmodule 196.

The wireless communication module 192 may support a 5G network, after a4th generation (4G) network, and next-generation communicationtechnology, e.g., new radio (NR) access technology. The NR accesstechnology may support enhanced mobile broadband (eMBB), massive machinetype communications (mMTC), or ultra-reliable and low-latencycommunications (URLLC). The wireless communication module 192 maysupport a high-frequency band (e.g., the millimeter wave (mmWave) band)to achieve, e.g., a high data transmission rate. The wirelesscommunication module 192 may support various technologies for securingperformance on a high-frequency band, such as, e.g., beamforming,massive multiple-input and multiple-output (massive MIMO), fulldimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or largescale antenna. The wireless communication module 192 may support variousrequirements specified in the electronic device 101, an externalelectronic device (e.g., the electronic device 104), or a network system(e.g., the second network 199). According to an embodiment, the wirelesscommunication module 192 may support a peak data rate (e.g., 20 gigabitsper second (Gbps) or more) for implementing eMBB, loss coverage (e.g.,164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 msor less for each of downlink (DL) and uplink (UL), or a round trip of 1ms or less) for implementing URLLC.

The antenna module 197 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 101. According to an embodiment, the antenna modulemay include an antenna including a radiating element composed of aconductive material or a conductive pattern formed in or on a substrate(e.g., a printed circuit board (PCB)). According to an embodiment, theantenna module 197 may include a plurality of antennas (e.g., arrayantennas). In such a case, at least one antenna appropriate for acommunication scheme used in the communication network, such as thefirst network 198 or the second network 199, may be selected, forexample, by the communication module 190 from the plurality of antennas.The signal or the power may then be transmitted or received between thecommunication module 190 and the external electronic device via theselected at least one antenna. According to an embodiment, anothercomponent (e.g., a radio frequency integrated circuit (RFIC)) other thanthe radiating element may be additionally formed as part of the antennamodule 197.

According to an embodiment, the antenna module 197 may form a mmWaveantenna module. According to an embodiment, the mmWave antenna modulemay include a printed circuit board, an RFIC disposed on a first surface(e.g., the bottom surface) of the printed circuit board, or adjacent tothe first surface and capable of supporting a designated high-frequencyband (e.g., the mmWave band), and a plurality of antennas (e.g., arrayantennas) disposed on a second surface (e.g., the top or a side surface)of the printed circuit board, or adjacent to the second surface andcapable of transmitting or receiving signals of the designatedhigh-frequency band.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

According to an embodiment, commands or data may be transmitted orreceived between the electronic device 101 and the external electronicdevice 104 via the server 108 coupled with the second network 199. Eachof the external electronic devices 102 or 104 may be a device of a sametype as, or a different type, from the electronic device 101. Accordingto an embodiment, all or some of operations to be executed at theelectronic device 101 may be executed at one or more external devices ofthe external electronic devices 102 or 104, or the server 108. Forexample, if the electronic device 101 should perform a function or aservice automatically, or in response to a request from a user oranother device, the electronic device 101, instead of, or in additionto, executing the function or the service, may request the one or moreexternal electronic devices to perform at least part of the function orthe service. The one or more external electronic devices receiving therequest may perform the at least part of the function or the servicerequested, or an additional function or an additional service related tothe request, and transfer an outcome of the performing to the electronicdevice 101. The electronic device 101 may provide the outcome, with orwithout further processing of the outcome, as at least part of a replyto the request. To that end, a cloud computing, distributed computing,mobile edge computing (MEC), or client-server computing technology maybe used, for example. The electronic device 101 may provide ultralow-latency services using, e.g., distributed computing or mobile edgecomputing. In an embodiment, the external electronic device 104 mayinclude an internet-of-things (IoT) device. The server 108 may be anintelligent server using machine learning and/or a neural network.According to an embodiment, the external electronic device 104 or theserver 108 may be included in the second network 199. The electronicdevice 101 may be applied to intelligent services (e.g., smart home,smart city, smart car, or healthcare) based on 5G communicationtechnology or IoT-related technology.

The electronic device according to embodiment(s) of the disclosure maybe one of various types of electronic devices. The electronic devicesmay include, for example, a portable communication device (e.g., asmartphone), a computer device, a portable multimedia device, a portablemedical device, a camera, a wearable device, or a home appliance.According to an embodiment of the disclosure, the electronic devices arenot limited to those described above.

It should be appreciated that embodiments of the disclosure and theterms used therein are not intended to limit the technological featuresset forth herein to particular embodiments and include various changes,equivalents, or replacements for a corresponding embodiment. With regardto the description of the drawings, similar reference numerals may beused to refer to similar or related elements. As used herein, each ofsuch phrases as “A or B”, “at least one of A and B”, “at least one of Aor B”, “A, B, or C”, “at least one of A, B, and C”, and “at least one ofA, B, or C”, may include any one of, or all possible combinations of theitems enumerated together in a corresponding one of the phrases. As usedherein, such terms as “1st” and “2nd”, or “first” and “second” may beused to simply distinguish a corresponding component from another, anddoes not limit the components in another aspect (e.g., importance ororder). It is to be understood that if an element (e.g., a firstelement) is referred to, with or without the term “operatively” or“communicatively”, as “coupled with”, “coupled to”, “connected with”, or“connected to” another element (e.g., a second element), it means thatthe element may be coupled with the other element directly (e.g.,wiredly), wirelessly, or via a third element.

As used in connection with embodiments of the disclosure, the term“module” may include a unit implemented in hardware, software, orfirmware, and may interchangeably be used with other terms, for example,“logic”, “logic block”, “part”, or “circuitry”. A module may be a singleintegral component, or a minimum unit or part thereof, adapted toperform one or more functions. For example, according to an embodiment,the module may be implemented in a form of an application-specificintegrated circuit (ASIC).

Embodiments of the disclosure may be implemented as software (e.g., theprogram) including one or more instructions that are stored in a storagemedium (e.g., an internal memory 136 or an external memory 138) that isreadable by a machine (e.g., the electronic device). For example, aprocessor (e.g., the processor) of the machine (e.g., the electronicdevice) may invoke at least one of the one or more instructions storedin the storage medium, and execute it. This allows the machine to beoperated to perform at least one function according to the at least oneinstruction invoked. The one or more instructions may include a codegenerated by a complier or a code executable by an interpreter. Themachine-readable storage medium may be provided in the form of anon-transitory storage medium. Wherein, the term “non-transitory” simplymeans that the storage medium is a tangible device, and does not includea signal (e.g., an electromagnetic wave), but this term does notdifferentiate between where data is semi-permanently stored in thestorage medium and where the data is temporarily stored in the storagemedium.

According to an embodiment, a method according to embodiment(s) of thedisclosure may be included and provided in a computer program product.The computer program product may be traded as a product between a sellerand a buyer. The computer program product may be distributed in the formof a machine-readable storage medium (e.g., compact disc read onlymemory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)online via an application store (e.g., PlayStore™), or between two userdevices (e.g., smart phones) directly. If distributed online, at leastpart of the computer program product may be temporarily generated or atleast temporarily stored in the machine-readable storage medium, such asmemory of the manufacturer's server, a server of the application store,or a relay server.

According to an embodiment, each component (e.g., a module or a program)of the above-described components may include a single entity ormultiple entities, and some of the multiple entities may be separatelydisposed in different components. According to an embodiment, one ormore of the above-described components or operations may be omitted, orone or more other components or operations may be added. Alternativelyor additionally, a plurality of components (e.g., modules or programs)may be integrated into a single component. In such a case, theintegrated component may still perform one or more functions of each ofthe plurality of components in the same or similar manner as they areperformed by a corresponding one of the plurality of components beforethe integration. According to an embodiment, operations performed by themodule, the program, or another component may be carried outsequentially, in parallel, repeatedly, or heuristically, or one or moreof the operations may be executed in a different order or omitted, orone or more other operations may be added.

In the following detailed description, a longitudinal direction, a widthdirection, and/or a thickness direction of an electronic device may bereferred to, wherein the length direction may be defined as the “Y-axisdirection”, the width direction may be defined as the “X-axisdirection”, and/or the thickness direction may be defined as the “Z-axisdirection”. In an embodiment, “negative/positive (−/+)” may be referredto together with the Cartesian coordinate system illustrated in thedrawings regarding the directions in which components are oriented. Forexample, the front surface of an electronic device and/or a housing maybe defined as a “surface facing the +Z direction,” and the rear surfacemay be defined as a “surface facing the −Z direction.” In an embodiment,a side surface of the electronic device and/or the housing may includean area facing the +X direction, an area facing the +Y direction, anarea facing the −X direction, and/or an area facing the −Y direction. Inan embodiment, the “X-axis direction” may include both the “−Xdirection” and the “+X direction.” It is noted that these are based onthe Cartesian coordinate system described in the drawings for the sakeof brevity of description, and the descriptions of these directions orcomponents do not limit various embodiment(s) of the disclosure.

FIG. 2 is a perspective view illustrating the front surface of anelectronic device according to an embodiment of the disclosure.

FIG. 3 is a perspective view illustrating the rear surface of theelectronic device of FIG. 2 according to an embodiment of thedisclosure.

Referring to FIGS. 2 and 3 , an electronic device 200 according to anembodiment may include a housing 210 including a first surface (or afront surface) 210A, a second surface (or a rear surface) 210B, and aside surface 210C surrounding the space between the first surface 210Aand the second surface 210B. In another embodiment (not illustrated),the term “housing” may refer to a structure defining some of the firstsurface 210A, the second surface 210B, and the side surface 210C of FIG.2 . According to another embodiment, at least a portion of the firstsurface 210A may be configured with a substantially transparent frontsurface plate 202 (e.g., a glass plate and/or a polymer plate includingvarious coating layers). The second surface 210B may be configured witha substantially opaque rear surface plate 211. The rear surface plate211 may be made of, for example, coated and/or colored glass, ceramic,polymer, metal (e.g., aluminum, stainless steel (STS), and/ormagnesium), or a combination of two or more of these materials. The sidesurface 210C may be configured with a side surface structure (or a “sidesurface bezel structure”) 218 coupled to the front surface plate 202 andthe rear surface plate 211 and including metal and/or polymer. Inanother embodiment, the rear surface plate 211 and the side surfacestructure 218 may be configured integrally with each other, and mayinclude the same material (e.g., a metal material such as aluminum).

In the illustrated embodiment, the front surface plate 202 may includetwo first areas 210D, which are bent from the first surface 210A towardthe rear surface plate 211 and extend seamlessly, at the opposite longedges thereof. In the illustrated embodiment (see FIG. 3 ), the rearsurface plate 211 may include, at the opposite long edges thereof, twosecond areas 210E, which are bent from the second surface 210B towardthe front surface plate 202 and extend seamlessly. In an embodiment, thefront surface plate 202 (or the rear surface plate 211) may include onlyone of the first areas 210D (or the second areas 210E). In anembodiment, some of the first areas 210D and/or the second areas 210Emay not be included. In the above-described embodiments, when viewedfrom a side of the electronic device 200, the side surface structure 218may have a first thickness (or width) at the side surface side, at whichthe first areas 210D and/or the second areas 210E are not included, andmay have a second thickness, which is smaller than the first thicknessat the side surface side at which the first areas 210D and/or the secondareas 210E are included.

According to another embodiment, the electronic device 200 may includeat least one of a display 201, audio modules 203, 207, and 214, sensormodules 204, 216, and 219, camera modules 205, 212, and 213, key inputdevices 217, light-emitting elements 206, and connector holes 208 and209. In another embodiment, at least one of the components (e.g., thekey input devices 217 and/or the light-emitting elements 206) may beomitted from the electronic device 200, or other components may beadditionally included in the electronic device 200.

The display 201 may be visually exposed through a substantial portionof, for example, the front surface plate 202. In another embodiment, atleast a portion of the display 201 may be visually exposed through thefront surface plate 202 defining the first surface 210A and the firstareas 210D of the side surface 210C. In another embodiment, the edges ofthe display 201 may be configured to be substantially the same as theshape of the periphery of the front surface plate 202 adjacent thereto.In another embodiment (not illustrated), the distance between theperiphery of the display 201 and the periphery of the front surfaceplate 202 may be substantially constant in order to enlarge the visuallyexposed area of the display 201.

In another embodiment (not illustrated), recesses and/or openings may beprovided in a portion of the screen display area of the display 201, andone or more of the audio module 214, the sensor modules 204, the cameramodules 205, and the light-emitting elements 206, which are aligned withthe recesses or the openings, may be included. In an embodiment (notillustrated), the rear surface of the screen display area of the display201 may include at least one of the audio modules 214, the sensormodules 204, the camera modules 205, the fingerprint sensor (i.e.,fourth sensor module 216), and the light-emitting elements 206. In anembodiment (not illustrated), the display 201 may be coupled to ordisposed adjacent to a touch-sensitive circuit, a pressure sensorcapable of measuring a touch intensity (pressure), and/or a digitizerconfigured to detect an electromagnetic field-type stylus pen. Inanother embodiment, at least some of the sensor modules 204 and 219and/or at least some of the key input devices 217 may be disposed in thefirst areas 210D and/or the second areas 210E.

The audio modules 203, 207, and 214 may include a microphone hole 203and speaker holes 207 and 214. The microphone hole 203 may include amicrophone disposed therein to acquire external sound, and in anembodiment, a plurality of microphones may be disposed therein to beable to detect the direction of sound. The speaker holes 207 and 214 mayinclude an external speaker hole 207 and a call receiver hole (i.e.,speaker hole 214). In another embodiment, while implementing the speakerholes 207 and 214 and the microphone hole 203 as a single hole, orwithout the speaker holes 207 and 214, a speaker (e.g., a piezo speaker)may be included.

The sensor modules 204, 216, and 219 may generate electrical signals ordata values corresponding to an internal operating state of theelectronic device 200 and/or an external environmental state. The sensormodules 204, 216, and 219 may include, for example, a first sensormodule 204 (e.g., a proximity sensor) and/or a second sensor module (notillustrated) (e.g., a fingerprint sensor) disposed on the first surface210A of the housing 210, and/or a third sensor module 219 (e.g., an HRMsensor), and/or a fourth sensor module 216 (e.g., a fingerprint sensor)disposed on the second surface 210B of the housing 210. The fingerprintsensor may be disposed not only on the first surface 210A (e.g., thedisplay 201) of the housing 210, but also on the second surface 210B.The electronic device 200 may further include the sensor module 176 ofFIG. 1 , for example, at least one of a gesture sensor, a gyro sensor,an atmospheric pressure sensor, a magnetic sensor, an accelerationsensor, a grip sensor, a color sensor, an infrared (IR) sensor, abiometric sensor, a temperature sensor, a humidity sensor, and/or anilluminance sensor.

The camera modules 205, 212, and 213 may include a first camera device205 disposed on the first surface 210A of the electronic device 200, asecond camera device 212 disposed on the second surface 210B, and/or aflash 213. The camera devices 205 and 212 may include one or morelenses, an image sensor, and/or an image signal processor. The flash 213may include, for example, a light-emitting diode and/or a xenon lamp. Inanother embodiment, two or more lenses (e.g., an infrared camera lens, awide-angle lens, and a telephoto lens) and image sensors may be disposedon one surface of the electronic device 200.

The key input devices 217 may be disposed on the side surface 210C ofthe housing 210. In another embodiment, the electronic device 200 maynot include some or all of the above-mentioned key input devices 217,and a key input device 217 not included in the electronic device 200 maybe implemented in another form, such as a soft key, on the display 201.In another embodiment, the key input devices may include a sensor module216 disposed on the second surface 210B of the housing 210.

The light-emitting elements 206 may be disposed, for example, on thefirst surface 210A of the housing 210. The light-emitting elements 206provides, for example, the state information of the electronic device200 in an optical form. In an embodiment, the light-emitting elements206 may provide a light source that is interlocked with, for example,the operation of the camera module 205. The light-emitting elements 206may include, for example, an LED, an IR LED, and a xenon lamp.

The connector holes 208 and 209 may include a first connector hole 208,which is capable of accommodating a connector (e.g., a USB connector)for transmitting/receiving power and/or data to/from an externalelectronic device, and/or a second connector hole 209, which is capableof accommodating a connector (e.g., an earphone jack) fortransmitting/receiving an audio signal to/from an external electronicdevice.

FIG. 4 is an exploded perspective view illustrating the electronicdevice illustrated in FIG. 2 according to an embodiment of thedisclosure.

Referring to FIG. 4 , an electronic device 300 (e.g., the electronicdevice 200 in FIG. 2 or 3 ) may include a side surface structure 310(e.g., the side surface structure 218 in FIG. 2 ), a first supportmember 311 (e.g., the bracket), a front surface plate 320 (e.g., thefront surface plate 202 in FIG. 2 ), a display 330 (e.g., the display201 in FIG. 2 ), a printed circuit board 340 (e.g., a printed circuitboard (PCB), a printed board assembly (PBA), a flexible PCB (FPCB),and/or a rigid-flexible PCB (RFPCB)), a battery 350, a second supportmember 360 (e.g., a rear case), an antenna 370, and a rear surface plate380 (e.g., the rear surface plate 211 in FIG. 3 ). In an embodiment, inthe electronic device 300, at least one of the components (e.g., thefirst support member 311 and/or the second support member 360) may beomitted, or other components may be additionally included. At least oneof the components of the electronic device 300 may be the same as orsimilar to at least one of the components of the electronic device 200of FIG. 2 or 3 , and a redundant description thereof will be omittedbelow.

The first support member 311 may be disposed inside the electronicdevice 300, and may be connected to the side surface structure 310 ormay be configured integrally with the side surface structure 310. Thefirst support member 311 may be made of, for example, a metal materialand/or a non-metal (e.g., polymer) material. The display 330 may becoupled to one surface of the first support member 311, and the printedcircuit board 340 may be coupled to the other surface of the firstsupport member 311. On the printed circuit board 340, a processor, amemory, and/or an interface may be mounted. The processor may include atleast one of, for example, a central processing unit, an applicationprocessor, a graphics processor, an image signal processor, a sensor hubprocessor, or a communication processor.

The memory may include, for example, a volatile memory and/or anon-volatile memory.

The interface may include, for example, a high-definition multimediainterface (HDMI), a universal serial bus (USB) interface, an SD cardinterface, and/or an audio interface. The interface electrically and/orphysically connects, for example, the electronic device 300 to anexternal electronic device, and may include a USB connector, an SDcard/an MMC connector, and/or an audio connector.

The battery 350 is a device for supplying power to at least onecomponent of the electronic device 300, and may include, for example, anon-rechargeable primary battery, a rechargeable secondary battery,and/or a fuel cell. At least a portion of the battery 350 may bedisposed on substantially the same plane as, for example, the printedcircuit board 340. The battery 350 may be integrally disposed inside theelectronic device 300, or may be detachably disposed on the electronicdevice 300.

The antenna 370 may be disposed between the rear surface plate 380 andthe battery 350. The antenna 370 may include, for example, a near-fieldcommunication (NFC) antenna, a wireless charging antenna, and/or amagnetic secure transmission (MST) antenna. For example, the antenna 370performs short-range communication with an external device or maytransmit/receive power required for charging to/from an external devicein a wireless manner. In another embodiment, an antenna structure may beconfigured by a portion of the side surface structure 310 and/or aportion of the first support member 311, or a combination thereof.

In the following detailed description, reference may be made to theelectronic devices 101, 102, 104, 200, and 300 of the precedingembodiments, and the same reference numerals in the drawings are givenfor components that may be easily understood through the precedingembodiments or omitted, and a detailed description thereof may also beomitted.

FIG. 5 is a plan view exemplifying the rear surface of an electronicdevice (e.g., the electronic device 101, 102, 104, 200, or 300 in FIGS.1 to 4 ) according to an embodiment of the disclosure.

FIG. 6 is a cross-sectional view of a portion of the electronic devicetaken along line A-A′ of FIG. 5 according to an embodiment of thedisclosure.

FIG. 7 is a configuration view illustrating an optical path of a lensassembly in an electronic device according to an embodiment of thedisclosure.

Referring to FIGS. 5 and 6 , the electronic device 400 according to anembodiment of the disclosure may include a camera window 385 disposed onone surface (e.g., the second surface 210B in FIG. 3 ). In anembodiment, the camera window 385 may be a portion of the rear surfaceplate 380. In another embodiment, the camera window 385 may be coupledto the rear surface plate 380 via a decorative member 389, wherein, whenviewed from the outside, the decorative member 389 may be exposed in theform of wrapping the periphery of the camera window 385. According toanother embodiment, the camera window 385 may include a plurality oftransparent areas 387, and the electronic device 400 may receiveexternal light or transmit light to the outside through at least one ofthe transparent areas 387. For example, the electronic device 400 mayinclude at least one lens assembly 500 (e.g., the camera module 180,205, 212, or 213 in FIGS. 1 to 3 ) disposed to correspond to at leastsome of the transparent areas 387 and at least one light source (e.g.,an infrared light source) disposed to correspond to other ones of thetransparent areas 387. In an embodiment, the lens assembly 500 and/orthe light source may receive external light or emit light to the outsideof the electronic device 400 through any one of the transparent areas387. In another embodiment, the electronic device 400 and/or the lensassembly 500 may further include a camera support member 381. The camerasupport member 381 may allow at least one of the lens assembly 500and/or other lens assemblies (e.g., a wide-angle camera, anultra-wide-angle camera, and/or a macro camera) adjacent to the lensassembly 500 to be disposed or fixed inside the rear surface plate 380or the camera window 385. In another embodiment, the camera supportmember 381 may be substantially a portion of the first support member311 and/or the second support member 360 of FIG. 4 .

According to another embodiment, the electronic device 400 may includeat least one of a lens assembly 500 and/or a wide-angle camera, anultra-wide-angle camera, a macro camera, a telephoto camera, or aninfrared photodiode as a light-receiving element, and may include aflash (e.g., the flash 213 in FIG. 3 ) or an infrared laser diode as alight source and/or a light-emitting element. In another embodiment, theelectronic device 400 may emit an infrared laser toward a subject byusing an infrared laser diode and an infrared photodiode and may receivethe infrared laser reflected by the subject to detect a distance and/ordepth to the subject. In another embodiment, the electronic device 400may photograph a subject by using any one camera or two or more of thecameras in combination, and may provide illumination toward the subjectby using a flash, if necessary.

According to another embodiment, among the cameras, the wide-anglecamera, the ultra-wide-angle camera, and/or the close-up camera may havea smaller length in the optical axis direction of the lens(es) whencompared to the telephoto camera (e.g., the lens assembly 500). Forexample, in the telephoto camera (e.g., the lens assembly 500) having arelatively large focal length, the total track length of the lens(es)423 a, 423 b, and 423 c is larger than those of other cameras. The“total track length” may mean a distance from the object-side surface ofthe first lens on the object side to the imaging surface of the imagesensor 411. As in another embodiment to be described later (e.g., thelens assembly 600 in FIG. 8 ), when another optical member(s) (e.g., amirror and/or a prism) is(are) disposed between the lens(es) and theimage sensor, the “total track length” may be the distance from theobject-side surface of the first lens on the object side to thesensor-side surface of the first lens on the image sensor side. In anembodiment, the wide-angle camera, the ultra-wide-angle camera, and/orthe close-up camera may have substantially little effect on thethickness of the electronic device 400 even if the lens(es) is(are)arranged along the thickness (e.g., the thickness measured in the Z-axisdirection of FIG. 4 or 6 ) direction of the electronic device 400. Forexample, a wide-angle camera, an ultra-wide-angle camera, and/or aclose-up camera may be disposed in the electronic device 400 in thestate in which a direction in which light is incident from the outsideinto the electronic device 400 is substantially the same as the opticalaxis direction of the lens(es). In another embodiment, when compared toa wide-angle camera, an ultra-wide-angle camera, and/or a close-upcamera, the lens assembly 500 (e.g., a telephoto camera) has a smallerfield of view, but may be useful for photographing a subject from afarther distance, and may include more lenses 421 a, 421 b, 423 a, 423b, and 423 c. For example, when the lens(es) 423 a, 423 b, and 423 c ofthe lens assembly 500 is arranged in the thickness direction of theelectronic device 400 (e.g., the Z-axis direction), the thickness of theelectronic device 400 increases, or the lens assembly 500 maysubstantially protrude to the outside of the electronic device 400. Inanother embodiment of the disclosure, the lens assembly 500 may includeat least one refractive member 413 or 415 that reflects and/or refractsincident light IL in different directions. In implementing a telephotofunction, the lenses 423 a, 423 b, and 423 c may be arranged to moveforward or backward in the incident direction of light or the travelingdirection of reflected or refracted light, thereby suppressing orreducing the increase of the thickness of the electronic device 400.

Referring to FIGS. 6 and 7 , the folded camera (e.g., the lens assembly500) may include a first refractive member 413, a second refractivemember 415, an image sensor 411, and/or at least one lens system (e.g.,the second lens group 423 including the second lenses 423 a, 423 b, and423 c and/or the dummy member 423 d). In another embodiment, the atleast one optical member may guide or focus, to the second refractivemember 415, light RL1 reflected and/or refracted by the first refractivemember 413, and may block the light RL1 reflected and/or refracted bythe first refractive member 413 from being directly incident on theimage sensor 411.

According to another embodiment, the first refractive member 413 mayinclude, for example, a prism and/or a mirror. For example, the firstrefractive member 413 is configured as a prism including at least onemirror. For example, the first refractive member 413 is configured as aprism having at least one surface including a mirror. In anotherembodiment, the first refractive member 413 may reflect and/or refractlight IL, which is incident in a first direction D1, in a seconddirection D2 crossing the first direction D1. The first direction D1 maymean, for example, the direction in which light IL is incident on theelectronic device 400 and/or the lens assembly 500 from the outsidethrough any one of the transparent areas 387 of FIG. 5 whenphotographing a subject. In another embodiment, the first direction D1may mean a photographing direction, a direction toward a subject, adirection toward which the lens assembly 500 is directed, and/or adirection parallel thereto. In another embodiment, the first directionD1 may be parallel to the thickness direction of the electronic device400 and/or the Z-axis direction.

According to another embodiment, the second refractive member 415 mayinclude, for example, a prism and/or a mirror. For example, the secondrefractive member 415 is configured as a prism including at least onemirror. For example, the second refractive member 415 is configured as aprism having at least one surface including a mirror. In anotherembodiment, the second refractive member 415 may reflect and/or refractlight RL1, which is reflected and/or refracted by the first refractivemember 413 and is incident in the second direction D2, in the thirddirection D3 crossing the second direction D2. In another embodiment,the third direction D3 may be substantially perpendicular to the seconddirection D2. For example, the third direction D3 means a directionparallel to the Z-axis direction. However, an embodiment of thedisclosure is not limited thereto, and the third direction D3 may be adirection inclined with respect to the second direction D2 or the X-Yplane according to the arrangement of the lens assembly 500 and/or thesecond refractive member 415 in the electronic device 400 and thespecifications of the same. In another embodiment, the third directionD3 may be substantially parallel to the first direction D1.

According to another embodiment, the image sensor 411 may be configuredto detect the light RL2, which is reflected and/or refracted by thesecond refractive member 415 and is incident along the third directionD3. For example, the light IL incident from the outside is detected bythe image sensor 411 via the first refractive member 413 and the secondrefractive member 415, and the electronic device 400 and/or the lensassembly 500 may acquire a subject image based on a signal and/orinformation detected by the image sensor 411. In another embodiment, theimage sensor 411 may be disposed substantially parallel to the X-Yplane. For example, when the lens assembly 500 has an optical imagestabilization function of a structure that shifts the image sensor 411,the image sensor 411 moves horizontally in a plane perpendicular to thefirst direction D1 and/or the third direction D3.

According to another embodiment, in performing the optical imagestabilization function, the image sensor 411 may be shifted in thelength direction of the electronic device 400 (e.g., the Y-axisdirection) and/or the width direction of the electronic device 400(e.g., the X-axis direction). For example, by disposing the image sensor411 on a plane perpendicular to the first direction D1 and/or the thirddirection D3, it is easy to increase the size of the image sensor 411 inan electronic device having a small thickness (e.g., a thickness withinabout 10 mm) and/or to secure a space for the optical imagestabilization operation. In another embodiment, when the lens assembly500 is used as a telephoto camera, the quality of a captured image maybe further enhanced by being provided with the optical imagestabilization function. In another embodiment, when the image sensor 411is enlarged, the performance of the lens assembly 500 may be furtherenhanced.

According to another embodiment, the lens assembly 500 may furtherinclude a lens system (e.g., a first lens group 421 including one ormore lenses 421 a and 421 b) configured to guide and/or focus the lightIL, which is incident in the first direction D1, to the first refractivemember 413. In another embodiment, the first lens group 421 and/or thefirst lens (e.g., the first lens 421 a) disposed on the object side inthe lens assembly 500 may have a positive refractive power. For example,by configuring the first lens 421 a to focus and/or align the light IL,which is incident from the outside, to the first refractive member 413,the optical system from the first lens 421 a to the image sensor 411 isdownsized. According to another embodiment, the first lens group 421 mayfurther include an additional first lens(es) 42 lb in order to focusand/or align light incident from the outside.

According to another embodiment, the second lens group 423 may include adummy member 423 d and a light blocking member 425. The dummy member 423d may have, for example, a cylinder shape disposed inside the lensassembly 500 and/or the electronic device 400 and extending along thesecond direction D2, and may transmit the light RL1, which travels alongthe second direction D2. In another embodiment, the dummy member 423 dmay be one lens having a positive and/or negative refractive power. Inanother embodiment, the dummy member 423 d may be a component integratedwith any one of the second lenses 423 a, 423 b, and 423 c and/or thesecond refractive member 415.

According to another embodiment, the light blocking member 425 may beprovided and/or disposed on at least a portion of the outer peripheralsurface of the dummy member 423 d, and may absorb, scatter, or reflectlight. The light blocking member 425 may be provided by performing, forexample, etching or black lacquer processing, and/or printing and/ordepositing a reflective layer on at least a portion of the outerperipheral surface of the dummy member 423 d. In another embodiment,some of the light reflected and/or refracted by the first refractivemember 413 may be absorbed, scattered, and/or reflected by the lightblocking member 425. In another embodiment, the light blocking member425 may substantially block the light, which is reflected and/orrefracted by the first refractive member 413, from being direct incidentinto the image sensor 411 without passing through the second lens group423 and/or the second refractive member 415. For example, the lightsequentially passing through the first direction D1, the seconddirection D2, and/or the third direction D3 in the lens assembly 500(e.g., the light following the paths indicated by “IL,” “RL1,” and “RL2”in FIG. 7 ) is incident on the image sensor 411, and light travelingalong another path may be substantially blocked from being incident intothe image sensor 411.

According to another embodiment, at least one of the second lenses 423a, 423 b, and 423 c may move forward and backward between the firstrefractive member 413 and the second refractive member 415 alongsubstantially the same axis as the second direction D2. For example, theelectronic device 400 and/or the lens assembly 500 moves the at leastone of the second lens 423 a, 423 b, and 423 c forward and backwardabout an axis substantially the same as the second direction D2, therebyexecuting focal length adjustment and/or focus adjustment. A downsizedelectronic device such as a smartphone may have a thickness of about 10mm, and in this case, a range in which the lens is movable forward andbackward in the thickness direction may be limited.

According to an embodiment, the second direction D2 may be substantiallyparallel to the length direction (e.g., the Y-axis direction in FIG. 4), the width direction (e.g., the X-axis direction of FIG. 4 ), and/orthe X-Y plane, and the range in which at least one of the second lenses423 a, 423 b, and 423 c is move forward and backward may be large,compared to a general wide-angle camera that moves forward and backwardin the Z-axis direction for focus adjustment. For example, since atleast one of the second lens 423 a, 423 b, and 423 c moves forward andbackward along an axis substantially the same as the second directionD2, the telephoto performance is improved in the lens assembly 500, andthus the degree of freedom in design in securing a space for forward andbackward movement for focal length adjustment and/or focus adjustmentmay be improved.

According to an embodiment, the electronic device 400 and/or the lensassembly 500 may further include an infrared blocking filter 419. Inanother embodiment, the infrared blocking filter 419 may suppress orsubstantially block infrared or near-infrared wavelength band light frombeing incident into the image sensor 411, and may be disposed at anyposition in the optical path between the first lens 421 a and the imagesensor 411. In another embodiment, by disposing the infrared blockingfilter 419 at a position close to the image sensor 411 (e.g., betweenthe image sensor 411 and the second refractive member 415), it ispossible to suppress and/or prevent the infrared blocking filter 419from being visually exposed to the outside. In another embodiment, thefirst refractive member 413, the second refractive member 415, and/orthe at least one optical member (e.g., the second lens group 423) mayinclude an infrared blocking coating layer, in which case the infraredblocking filter 419 may be omitted. In another embodiment, the infraredblocking coating layer may be provided on at least one of the imagesensor-side surface and the object-side surface of the dummy member 423d and/or the second refractive member 415. Accordingly, the image sensor411 may detect light that substantially passes through the infraredblocking filter 419 (or the infrared blocking coating layer). Therefractive members 413 and 415 of the disclosure may be selectivelydesigned according to the structure of the lens assembly 500. Forexample, in an embodiment, the refractive member (e.g., the secondrefractive member 415 in FIG. 6 ) has a triangular prism shape. Inanother embodiment, the refractive member (e.g., the second refractivemember 415 in FIG. 7 ) may have a trapezoidal columnar shape. The shapesof the refractive members 413 and 415 are not limited to the structuresillustrated in this disclosure. For example, when the refractive members413 and 415 reflect, refract, or transmit light, the refractive members413 and 415 may have a shape other than the triangular prism shape orthe trapezoidal columnar shape. In another embodiment, the types ofrefractive members 413 and 415 to be disposed may be determined invarious ways. For example, the refractive member (e.g., the secondrefractive member 415 of FIG. 6 ) to be disposed is a prism. Forexample, the refractive member (e.g., the second refractive member 415of FIG. 7 ) to be disposed is a mirror. For example, the refractivemembers 413 and 415 includes a substantially transparent material. Forexample, the refractive members 413 and 415 is made of glass.

FIG. 8 is a view illustrating a lens assembly 600 (e.g., the cameramodule 180, 205, 212, or 213 in FIGS. 1 to 3 or the lens assembly 500 inFIG. 6 ) according to an embodiment of the disclosure.

FIG. 9 is a view illustrating a second optical member R2 of the lensassembly of FIG. 8 according to an embodiment of the disclosure.

FIG. 10 is a graph showing spherical aberration of the lens assembly ofFIG. 8 according to an embodiment of the disclosure.

FIG. 11 is a graph showing astigmatism of the lens assembly of FIG. 8according to an embodiment of the disclosure.

FIG. 12 is a graph showing distortion rate of the lens assembly of FIG.8 according to an embodiment of the disclosure.

FIG. 10 is a graph showing spherical aberration of the lens assembly 600according to an embodiment of the disclosure, in which the horizontalaxis represents a longitudinal spherical aberration coefficient, and thevertical axis represents a normalized distance from an optical axis. Achange in longitudinal spherical aberration according to a wavelength oflight is illustrated in FIG. 10 . Longitudinal spherical aberration isindicated for light having each of wavelengths of, for example, 656.3000(nanometer (NM)), 587.6000 (NM), 546.1000 (NM), 536.1000 (NM), and435.8000 (NM). FIG. 11 is a graph showing astigmatism (astigmatic fieldcurves) of the lens assembly 600 according to one of embodiments of thedisclosure for light having a wavelength of 546.1000 (NM), in which “x”illustrates a sagittal plane, and “y” illustrates a tangential plane(meridional plane). FIG. 12 is a graph showing distortion rate of thelens assembly 600 according to an embodiment of the disclosure, forlight having a wavelength of 546.1000 (NM). In the followingdescription, the lens assembly(ies) 600 has a structure includingoptical members R1 and R2 disposed between lenses L1, L2, L3, and L4 andthe image sensor (I). It is noted that, depending on the number of timeslight is reflected and/or refracted by the optical members R1 and R2,the negative and the positive may be reversed in the graphs of sphericalaberration, astigmatism, and/or distortion rate. In describing theembodiment(s) of the disclosure, optical data such as “total tracklength” or “focal length” may illustrate values in the state in whichthe optical members R1 and R2 are not included. For example, the firstoptical member R1 and/or the second optical member R2 may change thelight traveling path by performing reflection and/or refraction, and maynot substantially affect the optical performance (e.g., focal length,F-number and/or field of view) of the lens assembly 600.

Referring to FIGS. 8 and 9 , the lens assembly 600 (e.g., the cameramodule 180, 205, 212, or 213 in FIGS. 1 to 3 and/or the lens assembly500 in FIG. 6 ) may include at least two lenses L1, L2, L3, and L4, animage sensor I, and a plurality of optical members R1 and R2 disposedbetween the image sensor I and the at least two lenses (hereinafter,“lenses L1, L2, L3, and L4”). In FIG. 8 , “S2” may denote theobject-side surface of the first lens L1 among the lenses L1, L2, L3,and L4, and “S3” may denote the sensor-side surface of the first lensL1. When “sto” is added to a reference number indicating a lens surface,it may indicate that an aperture is implemented on the correspondinglens surface. For example, in the lens assembly 600 of FIG. 8 , adiaphragm is disposed on the object-side surface of the first lens L1.In an embodiment, “S4” may denote the object-side surface of the secondlens L2 among the lenses L1, L2, L3, and L4, and “S5” may denote thesensor-side surface of the second lens L2. In another embodiment, “S6”may denote the object-side surface of the third lens L3 among the lensesL1, L2, L3, and L4, and “S7” may denote the sensor-side surface of thethird lens L3. In another embodiment, “S8” may denote the object-sidesurface of the fourth lens L4 among the lenses L1, L2, L3, and L4, and“S9” may denote the sensor-side surface of the fourth lens L4. Tables 2,5, 8, 11, and 14 regarding lens data will be reviewed below, butreference numerals of lens surfaces not indicated in the drawings may bepresented, and reference numerals “S10 to S15” in the tables regardinglens data may refer to the surface(s) of the first optical member R1and/or the second optical member R2.

According to another embodiment, the plurality of optical members R1 andR2 may reflect, refract, and/or guide the light, which is incident inone direction (e.g., in the direction of a second optical axis O2), inanother direction (e.g., in the direction of a third optical axis O3).For example, among the plurality of optical members R1 and R2, the firstoptical member R1 (e.g., the first reflection surface RF) reflects,refracts, and/or guides the light, which is incident through the lensesL1, L2, L3, and L4, to the second optical member R2. In anotherembodiment, the second optical member R2 may guide the light, which isincident through the first optical member R1, to the image sensor I.According to another embodiment, the lens assembly 600 may furtherinclude an infrared blocking layer IFL. For example, the infraredblocking layer IFL is disposed on one of an incidence surface F1 and anemission surface F2 of the second optical member R2. In an embodiment,the infrared blocking layer IFL may be provided on one of the surfacesof the first optical member R1 or a surface of one of the lenses L1, L2,L3, and L4. According to another embodiment, as illustrated in a lensassembly 700 of FIG. 13 , an infrared blocking filter IF may be providedin addition to the lenses L1, L2, L3, and L4 or the optical members R1and R2. In another embodiment, when the infrared blocking filter IF isadditionally provided, no infrared blocking layer IFL may be disposed onthe lenses L1, L2, L3, and L4 and/or the optical members R1 and R2.

According to another embodiment, at least two (e.g., four) lenses L1,L2, L3, and L4 may be sequentially arranged along the direction of thefirst optical axis O1 from the object OB side. In another embodiment,the first optical axis O1 may be disposed to be substantially parallelto the front surface (e.g., the first surface 210A in FIG. 2 ) and/orthe rear surface (e.g., the second surface 210B in FIG. 3 ) of theelectronic device (e.g., the electronic device 101, 200, 300, or 400 inFIGS. 1 to 6 ). For example, even if the thickness of the electronicdevice 400 is reduced, the degree of freedom in design is high in thenumber and arrangement of lenses L1, L2, L3, and L4. According toanother embodiment, the electronic device 400 (e.g., the processor 120in FIG. 1 ) and/or the lens assembly 600 may cause at least one of thelenses L1, L2, L3, and L4 to move forward and backward along thedirection of the first optical axis O1. For example, by moving at leastone of the lenses L1, L2, L3, and L4 along the direction of the firstoptical axis O1, the focal length adjustment and/or the focus adjustmentis performed. In another embodiment, the electronic device 400 (e.g.,the processor 120 in FIG. 1 ) and/or the lens assembly 600 may performan optical image stabilization operation by causing at least one of thelenses L1, L2, L3, and L4 to move in a plane perpendicular to the firstoptical axis O1. From the description “move in a plane perpendicular tothe first optical axis O1,” it may be understood that the lens(es) L1,L2, L3, and L4 moves along at least two directions perpendicular to thefirst optical axis O1. The “at least two directions” may be, forexample, directions perpendicular to each other.

According to another embodiment, the image sensor I may be configured tocause the lens assembly 600 and/or the electronic device 400 includingthe same to acquire an image of a subject by receiving light guidedand/or focused light through the lenses L1, L2, L3, and L4. For example,the second optical axis O2 is disposed to be substantially parallel tothe front surface (e.g., the first surface 210A in FIG. 2 ) and/or therear surface (e.g., the second surface 210B in FIG. 3 ) of theelectronic device (e.g., the electronic device 101, 200, 300, or 400 inFIGS. 2 to 6 ). In another embodiment, the imaging surface img of theimage sensor I may be disposed in a direction crossing the first opticalaxis O1. For example, the imaging surface img of the image sensor I mayform an acute angle and/or an obtuse angle with the first optical axisO1. In another embodiment, from the description “the imaging surface imgmay be disposed in a direction crossing the first optical axis O1,” itmay be understood that the imaging surface img is disposed to beinclined with respect to the X axis, the Y axis and/or the Z axis ofFIGS. 2 to 6 . In another embodiment, since the image sensor I may bedisposed in various directions with respect to the alignment directionsof the lenses L1, L2, L3, and L4, the degree of freedom in design may beenhanced in manufacturing the lens assembly 600 and/or the electronicdevice 400 including the same.

According to another embodiment, the optical members R1 and R2 mayreflect and/or refract light incident thereon to change the travelingdirection of the light. For example, by disposing the optical members R1and R2 between the lenses L1, L2, L3, and L4 and the image sensor I, thedegree of freedom in design may be enhanced in laying out the lenses L1,L2, L3, and L4 and the image sensor I. Of the optical members R1 and R2,the first optical member R1 may be disposed between the lenses L1, L2,L3, and L4 and the image sensor I, and may receive light incidentthrough the lenses L1, L2, L3, and L4 in the direction of the firstoptical axis O1. In another embodiment, the first optical member R1 mayreflect and/or refract light incident through the lenses L1, L2, L3, andL4 in the direction of the first optical axis O1, thereby emitting thelight along the direction of the second optical axis O2 crossing thefirst optical axis O1. In the illustrated embodiment, the second opticalaxis O2 is exemplified for convenience of description, and theembodiment(s) of the disclosure are not limited thereto. The secondoptical axis O2 may be defined differently depending on an embodimentand/or the structure of the lens assembly 600 to be actuallymanufactured. In another embodiment, the first optical member R1 mayinclude a mirror and/or a prism.

It is noted that, although the first optical member R1 and the secondoptical member R2 are exemplified as independent components in adisclosed embodiment, the embodiment(s) of the disclosure are notlimited thereto. For example, the first optical member R1 and the secondoptical member R2 is integrally configured. In an embodiment, theemission surface of the first optical member R1 and the incidencesurface F1 of the second optical member R2 may be configured in acombined form. For example, an integrally configured optical member (notillustrated) includes a mirror and/or a prism. For example, theintegrally configured optical member (not illustrated) is configured asa prism including at least one mirror. For example, an integrallyconfigured optical member (not illustrated) is configured as a prism inwhich one surface includes a mirror and at least a portion of anothersurface includes a mirror.

According to another embodiment, among the plurality of optical membersR1 and R2, the first optical member R1 may be disposed between thelenses L1, L2, L3, and L4 and the second optical member R2. In anotherembodiment, the first optical member R1 may reflect and/or refract lightincident through the lenses L1, L2, L3, and L4 in the direction of thefirst optical axis O1, thereby emitting the light along the direction ofthe second optical axis O2 substantially perpendicular to the firstoptical axis O1. According to another embodiment, the angle at which thesecond optical axis O2 is inclined with respect to the first opticalaxis O1 may be implemented to be about 80 degrees or more and about 100degrees or less.

According to another embodiment, among the plurality of optical membersR1 and R2, the second optical member R2 may be disposed between thefirst optical member R1 and the image sensor I. For example, the secondoptical member R2 receives light incident through the first opticalmember R1 in the direction of the second optical axis O2 and may emitthe light to the image sensor I along the direction of the third opticalaxis O3 crossing the second optical axis O2. In another embodiment, thethird optical axis O3 may be disposed to be inclined at an angle otherthan perpendicular to the first optical axis O1. In another embodiment,the third optical axis O3 may be disposed to be inclined at an angleother than perpendicular to the second optical axis O2. In anotherembodiment, the third optical axis O3 may be disposed to besubstantially parallel to the first optical axis O1 and to be inclinedat an angle other than perpendicular to the second optical axis O2. Inthis way, the angles at which the optical axes O1, O2, and O3 areinclined with respect to each other may be designed in various waysdepending on embodiments. For example, the relative arrangement of theoptical axes O1, O2, and O3 may vary depending on the relativearrangement of the imaging surface img with respect to the first opticalaxis O1, or the structure of the lens assembly 600 and/or the electronicdevice 400 to be actually manufactured.

According to another embodiment, the second optical member R2 mayinclude a prism. In an embodiment, the second optical member R2 mayinclude a first surface (e.g., the incidence surface F1) facing thefirst optical member R1. For example, the incidence surface F1 isperpendicular to the second optical axis O2. Note, however, that theembodiment(s) of the disclosure are not limited thereto. In anotherembodiment, the second optical member R2 may include a second surface(e.g., the emission surface F2) facing the image sensor I. For example,the emission surface F2 is connected to the incidence surface F1 in aninclined state to form a first angle Ang-p1 with respect to theincidence surface F1. In another embodiment, the emission surface F2 mayprovide a total internal reflection environment for incident light(e.g., the light incident on the incidence surface F1 along thedirection of the second optical axis O2). For example, the emissionsurface F2 may reflect (or refract) incident light by being inclined ata predetermined angle with respect to the second optical axis O2.Conditions for the inclination angle of the emission surface F2 withrespect to the second optical axis O2 will be reviewed with reference toEquation 2 to be described below. As described above, the emissionsurface F2 may at least partially function as a reflector inside thesecond optical member. In another embodiment, the second optical memberR2 may include a second reflection surface F3 interconnecting theemission surface F2 and the incidence surface F1. For example, thesecond reflection surface F3 is connected to the emission surface F2 inthe state of forming a second angle Ang-p2, and may be connected to theincidence surface F1 in the state of forming a third angle Ang-p3. Inanother embodiment, when the second reflection surface F3 is disposedsubstantially parallel to the second optical axis O2, the inclinationangle of the emission surface F2 with respect to the second optical axisO2 may be defined as the second angle Ang-p2.

According to another embodiment, the light reflected by the emissionsurface F2 inside the second optical member R2 may be emitted to theoutside through the emission surface F2 after being reflected (orrefracted) again by the second reflection surface F3. For example, whenthe incidence angle is smaller than a predetermined angle, the emissionsurface F2 may provide a total internal reflection environment, and whenthe incidence angle is greater than the predetermined angle, theemission surface F2 may transmit light. In this way, light incident onthe second optical member R2 may be reflected at least twice and emittedto the image sensor I through the emission surface F2. In anotherembodiment, when the lens assembly 600 has a structure including aninfrared blocking layer IFL, the infrared blocking layer IFL may bedisposed on at least a portion of a surface of the second optical memberR2 (e.g., the incidence surface F1 and/or the emission surface F2). Theposition and size of the infrared blocking layer IFL may be variouslyselected in consideration of the path of light passing through thesecond optical member R2. In another embodiment, the infrared blockinglayer IFL may be disposed on at least one of the incidence surface F1and the emission surface F2.

According to another embodiment, the electronic device 400 (e.g., theprocessor 120 in FIG. 1 ) and/or the lens assembly 600 may executeoptical image stabilization by rotating or tilting at least one of theoptical members R1 and R2 (e.g., the first optical member R1) withrespect to the first optical axis O1. The “tilting operation” mayinclude, for example, an operation of rotating the first optical memberR1 around an arbitrary axis crossing the first optical axis O1. Thecentral axis of the tilting operation may be variously configureddepending on the structure of the lens assembly 600 and/or theelectronic device 400 to be actually manufactured.

According to another embodiment, the lens assembly 600 may furtherinclude another optical member (e.g., the first refractive member 413 inFIG. 6 ) disposed on the object OB side rather than the lenses L1, L2,L3, and L4. For example, a direction in which light is incident to theelectronic device 400 and/or the lens assembly 600 is different fromthat of the first optical axis O1. As described above, when thecomponents described above and/or to be described below regarding thelens assembly 600 of FIG. 8 are satisfied, other components of theembodiments disclosed herein (e.g., the first lens group 421, the firstrefractive member 413, the dummy member 423 d, and/or the light blockingmember 425 in FIG. 6 ) may be selectively combined to implementadditional embodiments.

According to another embodiment, the lens assembly described aboveand/or to be described below (e.g., the lens assembly 600, 700, 800,900, 1000, or 1100 in FIGS. 8, 13, 17, 21 and/or 25 ) may satisfy thecondition of Equation 1 below.

$\begin{matrix}{0.1 \leq \frac{TTL}{f} \leq 0.35} & {{Equation}(1)}\end{matrix}$

“TTL” is a length from the object-side surface S2 of the first lens onthe object OB side (e.g., the first lens L1) among the lenses L1, L2,L3, and L4 and the sensor-side surface S9 of the first lens on the imagesensor I side (e.g., the fourth lens L4), and may be understood as a“total track length.” In a structure in which the optical members R1 andR2, which change the light traveling path between the lenses L1, L2, L3,and L4 and the image sensor I are not arranged, the “total track length”may be understood as the distance from the object-side surface of thefirst lens on the object OB side to the imaging surface of the imagesensor. In Equation 1, “f” may be a focal length (e.g., an effectivefocal length) of the lens assembly 600. When the condition of Equation 1is not satisfied, for example, when the value of Equation 1 is smallerthan the total track length becomes smaller, and thus it may bedifficult to arrange the lenses L1, L2, L3, and L4 and to secure goodoptical performance. When the value of Equation 1 is greater than 0.35,the total track length increases, and thus it may be difficult to mountthe lens assembly 600 in a downsized electronic device.

According to another embodiment, the lens assemblies 600, 700, 800, 900,1000, and 1100 described above and/or to be described below may satisfythe condition of Equation 2 below.

15≤Ang-min≤40  Equation (2)

“Ang-min” is the smallest angle among the angles formed by two adjacentsurfaces of the second optical member R2 (e.g., the first angle Ang-p1,the second angle Ang-p2, and/or the third angle Ang-p3). In theembodiment of FIG. 8 and/or the embodiment of FIG. 9 , the second angleAng-p2 may be the “Ang-min” in Equation 2. When the angle value ofEquation 2 is smaller than 15 degrees, the size of the second opticalmember R2 increases, which may make downsizing difficult. In anembodiment, when the value of Equation 2 is greater than 40 degrees,reflection performance of the emission surface F2 inside the secondoptical member R2 may be lowered. For example, when the condition ofEquation 2 is satisfied, the emission surface F2 inside the secondoptical member R2 totally reflects light incident along the direction ofthe second optical axis O2. According to another embodiment, in thesecond optical member R2, when the third angle Ang-p3 is a right angleand the second angle Ang-p2 is “Ang-min,” the second angle Ang-p3 may beimplemented as an angle of about 25 degrees or more and about 35 degreesor less. According to another embodiment, the third angle Ang-p3 of thesecond optical member R2 may be implemented as an angle of about 75degrees or more and about 105 degrees or less.

According to another embodiment, the lens assemblies 600, 700, 800, 900,1000, and 1100 described above and/or to be described below may satisfythe condition of Equation 3 below.

$\begin{matrix}{{- 2} \leq \frac{f1}{f2} \leq {- 0.1}} & {{Equation}(3)}\end{matrix}$

Here, “f1” may be the focal length (e.g., effective focal length) of thefirst lens on the object OB side (e.g., the first lens L1), and “f2” maybe the focal length of the second lens on the object OB side (e.g., thesecond lens L2). When the condition of Equation 3 is satisfied, it maybe easy to correct aberration in the lens assembly 600, and the lensassembly 600 may be downsized. For example, when the value of Equation 3is greater than −0.1, it may be difficult to correct chromaticaberration or spherical aberration. In another embodiment, when thevalue of Equation 3 is smaller than −2, the power of the first lens L1is lowered, so the total track length may be increased.

According to another embodiment, the lens assemblies 600, 700, 800, 900,1000, and 1100 described above and/or to be described below may satisfythe conditions of the following Equation 4 regarding the Abbe number ofthe first lens (e.g., the first lens L1) on the object side OB, Vd-1.

25≤Vd-1≤95  Equation (4)

When the value of Equation 4 is greater than 95, the possibility ofdamage to the first lens L1 due to an external impact or scratches mayincrease, and when the value of Equation 4 is less than 25, it may bedifficult to correct chromatic aberration.

According to another embodiment, the lens assemblies 600, 700, 800, 900,1000, and 1100 described above and/or to be described below may satisfythe condition of Equation 5 below.

$\begin{matrix}{0.1 \leq \frac{t - {L1}}{TTL} \leq 0.5} & {{Equation}(5)}\end{matrix}$

Here, “t-L1” may be the thickness of the first lens on the object sideOB (e.g., the first lens L1), and “TTL” may be the length from theobject-side surface S2 of the first lens L1 and the sensor-side surfaceS9 of the first lens on the image sensor I side (e.g., the fourth lensL4). When the value of Equation 5 is greater than 0.5, the thickness ofthe first lens L1 increases and it is difficult to secure thethicknesses of the remaining lenses L2, L3, and L4 or the intervalsbetween the lenses L1, L2, L3, and L4. Thus, it may be difficult tosecure good performance of the lens assembly 600. In another embodiment,when the value of Equation 5 is less than 0.1, the thickness of thefirst lens L1 is reduced, and thus it may be difficult to secure asuitable refractive power or to manufacture the first lens L1 in adesigned shape.

According to another embodiment, the lens assemblies 600, 700, 800, 900,1000, and 1100 described above and/or described below may satisfy thecondition of the following Equation 6 regarding a field of view (FoV).

5≤FoV≤35  Equation (6)

When the condition of Equation 6 is satisfied, the lens assembly 600 maybe easily downsized while providing a space for arranging the pluralityof optical members R1 and R2. For example, when the field of view isless than 5 degrees, the focal length of the lens assembly 600 becomeslong, which may make downsizing difficult. In an embodiment, when thefield of view is greater than 35 degrees, the interval between thelens(es) L1, L2, L3, and L4 and the image sensor I is reduced, and thusit may be difficult to dispose the first optical member R1 and/or thesecond optical member R1.

As described in Table 1, the lens assemblies 600, 700, 800, 900, 1000,and 1100 of the embodiments described above or to be described below maysatisfy the condition(s) presented through the equations describedabove. In Table 1, the smallest angle Ang-min in Equation 2 may beexemplified as the second angle Ang-p2 in the second optical member R2of each embodiment.

TABLE 1 Equation Equation Equation Equation Equation Equation 1 2 3 4 56 Embodiment 1 0.267 30 −0.659 37.4 0.369 25.96 (FIG. 8) Embodiment 20.267 30 −1.145 56.09 0.393 26.01 (FIG. 13) Embodiment 3 0.267 30 −0.63337.4 0.333 26.01 (FIG. 17) Embodiment 4 0.275 30 −0.753 37.4 0.263 26.29(FIG. 21) Embodiment 5 0.267 30 −0.312 55.71 0.259 26.39 (FIG. 25)Embodiment 6 0.220 30 −0.635 44.9 0.386 18.79 (FIG. 29)

According to another embodiment, the lens assembly 600 may have a focallength of approximately 9.73 mm, an F-number of 3.475, a total tracklength of 2.6 mm, an image height of 2.28 mm, and/or a field of view(FoV) of 25.96 degrees. The total track length may be understood as, forexample, the distance from the object-side surface S2 of the first lensL1 to the sensor-side surface S9 of the fourth lens L4, and the imageheight is the maximum distance from the optical axis O3 to the edge ofthe imaging surface (img), and may be understood, for example, as halfof the diagonal length of the imaging surface (img). The lens assembly600 may satisfy at least some of the conditions presented through theabove-described Equations, and may be manufactured in the specificationsexemplified in Table 2 below.

TABLE 2 Effective Lens Radius of Focal Refractive Abbe SurfacesCurvature Thickness Length Index Number Refraction (Surf) (Radius)(Thick) (EFL) (nd) (vd) Mode Obj infinity infinity S1 infinity 0.00000S2*(sto) 2.39198 0.96020 4.050 1.56717 37.4 refraction S3* −58.850400.05000 refraction S4* 3.46210 0.41168 −6.147 1.67074 19.24 refractionS5* 1.80126 0.35095 refraction S6* −13.72389 0.37625 6.457 1.67074 19.24refraction S7* −3.35921 0.10092 refraction S8* −6.44467 0.35000 −4.7511.67074 19.24 refraction S9* 6.59759 0.50000 refraction S10 infinity1.20000 infinity 1.94593 17.98 refraction S11 infinity −1.20000 infinity−1.94593 17.98 total internal reflection S12 infinity −0.60000refraction S13 infinity −2.20000 infinity −1.51680 64.17 refraction S14infinity 1.80000 infinity 1.51680 64.17 total internal reflection S15infinity −0.90000 infinity −1.51680 64.17 reflection S16 infinity 0refraction S17 infinity 0 refraction S18 infinity −0.42119 refractionImg infinity −0.0115 refraction

In Table 2, a lens surface marked with “sto” may function as anaperture, and an aspherical lens surface may be marked with a symbol“*”. Like “S1” and/or “S10 to S18”, the surfaces described in Table 2but not described in the drawings may be the surfaces of a cover window(e.g., the camera window 385 in FIG. 5 or 6 ), mechanical structuresreferred to in arrangement design of the lens L1, L2, L3, and L4 oroptical members R1 and R2, and/or the optical members R1 and R2.Although not directly described in the drawings, the surfaces describedin Table 2 are located on, for example, the path along which externallight reaches to the image sensor I, but may not substantially affectthe optical performance of the lens assembly 600. In the disclosedembodiment(s), the refraction mode in Table 2 exemplifies whether lightbeam traveling is refracted (refraction), reflected (reflection), orreflected by total internal reflection (TIR). Since a light beamtraveling direction is changed when reflection occurs by the opticalmembers R1 and R2, in the graphs of FIGS. 10 and 11 related to sphericalaberration and/or astigmatism according to the number of reflections,“+” and “−” may be reversed.

In the following Tables 3 and 4, the aspherical surface coefficients ofthe first to fourth lenses L1, L2, L3, and L4 are described, and thedefinition of the aspherical surface may be calculated through Equation7 below:

$\begin{matrix}{z = {\frac{c^{\prime}y^{2}}{1 + \sqrt{1 - {\left( {K + 1} \right)c^{\prime^{2}}y^{2}}}} + {Ay}^{4} + {By}^{6} + {Cy}^{8} + {Dy}^{10} + {Ey}^{12} + {Fy}^{14} + {Gy}^{16} + {Hy}^{18} + {Jy}^{20}}} & {{Equation}(7)}\end{matrix}$

Here, “z” may mean a distance from the apex of a lens(es) L1, L2, L3, orL4 in the direction of the optical axis (e.g., the first optical axisO1), “y” may mean a distance in a direction perpendicular to the firstoptical axis O1, “C” may mean a reciprocal of the radius of curvature atthe apex of the lens(es) L1, L2, L3, or L4, “K” may mean a conicconstant, and “A,” “B,” “C,” “D,” “E,” “F,” “G,” “H,” and “J” may meanaspherical surface coefficients, respectively. The radius of curvature(Radius) may represent, for example, a value indicating the degree ofcurvature in each point of a curved surface or curved line.

TABLE 3 Lens Surfaces (Surf) S2* S3* S4* S5* Radius 2.39198E+00−5.88504E+01  3.46210E+00  1.80126E+00 K(Conic) 4.50896E−02 −1.38710E+01−3.96270E+01 −1.03648E+01 A(4th)/C4 5.47440E−03 −7.37513E−02−5.96554E−02 −3.67511E−02 B(6th)/C5 −1.66325E−02   3.77928E−01 4.35788E−01  5.13135E−01 C(8th)/C6 3.80893E−02 −8.53122E−01−9.40087E−01 −1.26182E 00  D(10th)/C7 −5.05520E−02   1.09324E+00 9.11147E−01  1.72628E+00 E(12th)/C8 3.80753E−02 −7.88205E−01−4.38248E−02 −7.31648E−01 F(14th)/C9 −1.40990E−02   2.78636E−01−7.71345E−01 −1.38027E+00 G(16th)/C10 9.79239E−04 −1.40389E−02 7.30864E−01  2.11749E+00 H(18th)/C11 8.32481E−04 −1.87788E−02−2.83478E−01 −1.11001E+00 J(20th)/C12 −1.75300E−04   3.86649E−03 4.12930E−02  2.07291E−01

TABLE 4 Lens Surfaces (Surf) S6* S7* S8* S9* Radius −1.37239E+01−3.35921E+00 −6.44467E+00 6.59759E+00 K(Conic)  2.24390E+01 −2.23591E+01−9.90000E+01 3.12155E+01 A(4th)/C4 −3.16984E−01 −4.79497E−01−2.99946E−01 −3.06924E−02  B(6th)/C5  1.03310E+00  1.66934E+00 1.03750E+00 −6.18859E−02  C(8th)/C6 −2.04524E+00 −3.11570E+00−1.26376E+00 6.18913E−01 D(10th)/C7  4.13370E+00  4.87427E+00−7.69160E−01 −2.42981E+00  E(12th)/C8 −7.41189E+00 −7.82473E+00 3.38959E+00 4.86338E+00 F(14th)/C9  8.99547E+00  1.00064E+01−2.76255E+00 −5.50440E+00  G(16th)/C10 −6.62762E+00 −7.85074E+00 5.85461E−02 3.52201E+00 H(18th)/C11  2.68492E+00  3.21812E+00 8.56664E−01 −1.17108E+00  J(20th)/C12 −4.59202E−01 −5.16612E−01−2.86224E−01 1.52382E−01

In embodiments described below, reference numerals for optical axes,lenses, and/or lens surfaces may be omitted from the drawings forbrevity of the drawings. Reference numerals omitted in the drawings willbe easily understood by those skilled in the art by further referring toFIG. 8 or through lens data and drawings presented in each embodiment.

FIG. 13 is a view illustrating a lens assembly (e.g., the camera module180, 205, 212, or 213 in FIGS. 1 to 3 or the lens assembly 500 in FIG. 6) according to an embodiment of the disclosure.

FIG. 14 is a graph showing spherical aberration of the lens assembly \of FIG. 13 according to an embodiment of the disclosure.

FIG. 15 is a graph showing astigmatism of the lens assembly of FIG. 13according to an embodiment of the disclosure.

FIG. 16 is a graph showing distortion rate of the lens assembly of FIG.13 according to an embodiment of the disclosure.

Referring to FIGS. 13 to 16 , a lens assembly 700 may have a focallength of about 9.73 mm, an F-number of 3.475, a total track length of2.6 mm, an image height of 2.28 mm, and/or a field of view of 26.01degrees. The total track length may be understood as, for example, thedistance from the object-side surface S2 of the first lens L1 to thesensor-side surface S9 of the fourth lens L4, and the image height isthe maximum distance from the optical axis O3 to the edge of the imagingsurface (img), and may be understood, for example, as half of thediagonal length of the imaging surface (img). The lens assembly 700 maybe manufactured with the specifications exemplified in the followingTable 5 while satisfying at least some of the conditions presentedthrough the above-described equations, and the aspherical surfacecoefficients of Tables 6 and 7.

According to an embodiment, the lens assembly 700 may further include aninfrared blocking filter IF disposed between the image sensor I and thesecond optical member R2. When the lens assembly 700 includes aninfrared blocking filter IF disposed in addition to the lenses L1, L2,L3, and L4 or the optical members R1 and R2, the infrared blocking layer(e.g., the infrared blocking layer IFL in FIG. 9 ) may be omitted fromthe surface of each of the lenses L1, L2, L3, and L4 or each of theoptical members R1 and R2.

TABLE 5 Effective Lens Radius of Focal Refractive Abbe SurfacesCurvature Thickness Length Index Number Refraction (Surf) (Radius)(Thick) (EFL) (nd) (vd) Mode Obj infinity infinity S1 infinity 0.00000S2* 2.89245 1.02176 2.353 1.54410 56.09 refraction S3* −2.02593 0.19824refraction S4* −3.11610 0.35000 −2.055 1.56717 37.4 refraction S5*1.95734 0.30000 refraction S6* −89.71509 0.35000 28.764 1.61554 25.8refraction S7* −14.92158 0.03000 refraction S8* 10.00486 0.35000 69.1461.66074 20.38 refraction S9*(sto) 12.59048 0.50000 refraction S10infinity 1.10000 infinity 1.71736 29.5 refraction S11 infinity −1.10000infinity −1.71736 29.5 total internal reflection S12 infinity −0.50000refraction S13 infinity −2.45000 infinity −1.49700 81.61 refraction S14infinity 1.50000 infinity 1.49700 81.61 total internal reflection S15infinity −1.50000 infinity −1.49700 81.61 reflection S16 infinity 0refraction S17 infinity −0.53621 refraction Img infinity −0.0095refraction

TABLE 6 Lens Surfaces (Surf) S2* S3* S4* S5* Radius  2.89245E+00−2.02593E+00 −3.11610E+00  1.95734E+00 K(Conic) −5.15677E−02−2.65980E+01 −9.90000E+01 −1.31788E+01 A(4th)/C4 −4.46070E−03−5.68160E−02  2.16330E−01  5.80100E−01 B(6th)/C5 −1.27769E−04 4.51103E−02 −1.19656E+00 −2.16169E+00 C(8th)/C6 −7.99375E−03 4.75279E−02  3.20456E+00  3.99256E+00 D(10th)/C7  1.85932E−02−7.51864E−02 −4.96843E+00 −3.62159E+00 E(12th)/C8 −1.63235E−02 3.06638E−02  4.93761E+00 −4.52961E−01 F(14th)/C9  7.48600E−03 9.61607E−03 −3.19916E+00  4.90387E+00 G(16th)/C10 −1.46028E−03−1.19814E−02  1.31020E+00 −5.21051E+00 H(18th)/C11 −4.05371E−05 3.39415E−03 −3.08938E−01  2.42985E+00 J(20th)/C12  4.21895E−05−2.42152E−04  3.21118E−02 −4.37654E−01

TABLE 7 Lens Surfaces (Surf) S6* S7* S8* S9* Radius −8.97151E+01 −1.49216E+01 1.00049E+01 1.25905E+01 K(Conic) 9.90000E+01 −9.90000E+016.98064E+01 6.45717E+01 A(4th)/C4 1.35468E−01 −8.05339E−01 −8.60973E−01 −7.66905E−02  B(6th)/C5 1.88585E−01  5.91813E+00 5.35525E+00 2.41507E−01C(8th)/C6 −3.06198E+00  −2.30189E+01 −1.94061E+01  −3.74020E−01 D(10th)/C7 7.40884E+00  5.35609E+01 4.48818E+01 4.49977E−01 E(12th)/C8−8.97750E+00  −7.89370E+01 −6.71722E+01  −5.91390E−01  F(14th)/C96.67993E+00  7.56148E+01 6.50696E+01 7.09221E−01 G(16th)/C10−3.31559E+00  −4.61193E+01 −3.96161E+01  −5.85907E−01  H(18th)/C111.06438E+00  1.63701E+01 1.38395E+01 2.75422E−01 J(20th)/C12−1.66404E−01  −2.57932E+00 −2.12182E+00  −5.49111E−02 

FIG. 17 is a view illustrating a lens assembly (e.g., the camera module180, 205, 212, or 213 in FIGS. 1 to 3 and/or the lens assembly 500 inFIG. 6 ) according to an embodiment of the disclosure.

FIG. 18 is a graph showing spherical aberration of the lens assembly ofFIG. 17 according to an embodiment of the disclosure.

FIG. 19 is a graph showing astigmatism of the lens assembly of FIG. 17according to an embodiment of the disclosure.

FIG. 20 is a graph showing distortion rate of the lens assembly of FIG.17 according to an embodiment of the disclosure.

Referring to FIGS. 17 to 20 , a lens assembly 800 may have a focallength of about 9.75 mm, an F-number of 3.533, a total track length of2.6 mm, an image height of 2.28 mm, and/or a field of view of 26.01degrees. The total track length may be understood as, for example, thedistance from the object-side surface S2 of the first lens L1 to thesensor-side surface S9 of the fourth lens L4, and the image height isthe maximum distance from the optical axis O3 to the edge of the imagingsurface (img), and may be understood, for example, as half of thediagonal length of the imaging surface (img). The lens assembly 800 maybe manufactured with the specifications exemplified in the followingTable 8 while satisfying at least some of the conditions presentedthrough the above-described equations, and the aspherical surfacecoefficients of Tables 9 and 10.

TABLE 8 Effective Lens Radius of Focal Refractive Abbe SurfacesCurvature Thickness Length Index Number Refraction (Surf) (Radius)(Thick) (EFL) (nd) (vd) Mode Obj infinity infinity S1 infinity 0.00000S2*(sto) 2.77006 0.86599 4.031 1.56717 37.4 refraction S3* −12.037900.06160 refraction S4* 2.88557 0.37205 −6.369 1.65035 21.53 refractionS5* 1.62093 0.43149 refraction S6* −3.83961 0.40769 3.844 1.65035 21.53refraction S7* −1.58818 0.11118 refraction S8* −2.94631 0.35000 −3.2531.67074 19.24 refraction S9* 9.24009 0.70000 refraction S10 infinity1.25000 infinity 1.94593 17.98 refraction S11 infinity −1.25000 infinity−1.94593 17.98 total internal reflection S12 infinity −0.40000refraction S13 infinity −2.20000 infinity −1.51680 64.17 refraction S14infinity 2.00000 infinity 1.51680 64.17 total internal reflection S15infinity −1.00000 infinity −1.51680 64.17 reflection S16 infinity 0refraction S17 infinity 0 refraction S18 infinity −0.4879 refraction Imginfinity −0.0115 refraction

TABLE 9 Lens Surfaces (Surf) S2* S3* S4* S5* Radius 2.77006E+00−1.20379E+01 2.88557E+00  1.62093E+00 K(Conic) −8.10478E−02 −1.07329E+01 −3.52748E+01  −1.23794E+01 A(4th)/C4 3.89242E−03−1.22249E−03 6.63243E−02  1.58664E−01 B(6th)/C5 2.12816E−03  7.89209E−02−1.44481E−01  −4.40392E−01 C(8th)/C6 −2.36071E−02  −2.30898E−013.86720E−01  1.44789E+00 D(10th)/C7 5.43328E−02  3.80458E−01−8.75872E−01  −3.49196E+00 E(12th)/C8 −6.93422E−02  −3.95273E−011.24937E+00  5.11237E+00 F(14th)/C9 5.39312E−02  2.69230E−01−1.06110E+00  −4.32867E+00 G(16th)/C10 −2.52394E−02  −1.18898E−015.12826E−01  1.90746E+00 H(18th)/C11 6.50235E−03  3.10830E−02−1.27018E−01  −3.12209E−01 J(20th)/C12 −7.06822E−04  −3.63698E−031.19052E−02 −1.48722E−02

TABLE 10 Lens Surfaces (Surf) S6* S7* S8* S9* Radius −3.83961E+00−1.58818E+00  −2.94631E+00 9.24009E+00 K(Conic) −1.84495E+01 3.92612E−02−6.39361E+01 5.58050E+01 A(4th)/C4 −1.69007E−01 1.11348E−01 −1.13976E−012.54008E−02 B(6th)/C5  3.19143E−01 2.47133E−01  8.97714E−01−9.51414E−02  C(8th)/C6  5.07715E−01 1.51521E−01 −2.78258E+001.17247E−01 D(10th)/C7 −3.29326E+00 −2.83173E+00   4.75363E+00−2.00145E−01  E(12th)/C8  6.64886E+00 7.24173E+00 −4.98512E+003.37174E−01 F(14th)/C9 −7.13404E+00 −9.33951E+00   3.10410E+00−4.00681E−01  G(16th)/C10  4.25874E+00 6.79319E+00 −9.67449E−012.92626E−01 H(18th)/C11 −1.30636E+00 −2.65449E+00   4.06789E−02−1.18844E−01  J(20th)/C12  1.55300E−01 4.34723E−01  3.73469E−022.05172E−02

FIG. 21 is a view illustrating a lens assembly (e.g., the camera module180, 205, 212, or 213 in FIGS. 1 to 3 or the lens assembly 500 in FIG. 6) according to an embodiment of the disclosure.

FIG. 22 is a graph showing spherical aberration of the lens assembly ofFIG. 21 according to an embodiment of the disclosure.

FIG. 23 is a graph showing astigmatism of the lens assembly of FIG. 21according to an embodiment of the disclosure.

FIG. 24 is a graph showing distortion rate of the lens assembly of FIG.21 according to an embodiment of the disclosure.

Referring to FIGS. 21 to 24 , a lens assembly 900 may have a focallength of about 9.68 mm, an F-number of 2.881, a total track length of2.66 mm, an image height of 2.28 mm, and/or a field of view of 26.29degrees. The total track length may be understood as, for example, thedistance from the object-side surface S2 of the first lens L1 to thesensor-side surface S9 of the fourth lens L4, and the image height isthe maximum distance from the optical axis O3 to the edge of the imagingsurface (img), and may be understood, for example, as half of thediagonal length of the imaging surface (img). The lens assembly 900 maybe manufactured with the specifications exemplified in the followingTable 11 while satisfying at least some of the conditions presentedthrough the above-described equations, and the aspherical surfacecoefficients of Tables 12 and 13.

TABLE 11 Effective Lens Radius of Focal Refractive Abbe SurfaceCurvature Thickness Length Index Number Refraction (Surf) (Radius)(Thick) (EFL) (nd) (vd) Mode Obj infinity infinity S1 infinity 0.00000S2* 10.23859 0.69844 4.830 1.56717 37.4 refraction S3* −3.67904 0.03000refraction S4* 2.44406 0.55983 −6.415 1.67074 19.24 refraction S5*1.42049 0.54467 refraction S6* −4.25861 0.49706 3.975 1.63491 23.98refraction S7* −1.66696 0.03000 refraction S8* −1.76751 0.30000 −4.7881.67074 19.24 refraction S9*(sto) −4.13991 0.70654 refraction S10infinity 1.25000 refraction S11 infinity −1.25000 total internalreflection S12 infinity −0.40000 refraction S13 infinity −2.11200infinity −1.51680 64.17 refraction S14 infinity 1.92000 infinity 1.5168064.17 total internal reflection S15 infinity −0.96000 infinity −1.5168064.17 reflection S16 infinity 0 refraction S17 infinity −0.51558refraction img infinity 0.0121 refraction

TABLE 12 Lens Surfaces (Surf) S2* S3* S4* S5* Radius 1.02386E+01−3.67904E+00 2.44406E+00 1.42049E+00 K(Conic) 4.81667E+00 −7.67180E+00−1.27930E+01  −3.65531E+00  A(4th)/C4 −5.69341E−03  −1.41529E−026.40785E−02 1.03174E−01 B(6th)/C5 1.09285E−02  3.11212E−02 −1.45066E−01 −3.28039E−01  C(8th)/C6 −1.42841E−02  −3.52427E−02 1.78679E−015.34709E−01 D(10th)/C7 8.19285E−03  2.12171E−02 −1.58613E−01 −5.65257E−01  E(12th)/C8 −2.45082E−03  −6.70839E−03 9.69236E−023.91252E−01 F(14th)/C9 3.86474E−04  1.03371E−03 −3.74055E−02 −1.71139E−01  G(16th)/C10 −2.11244E−05  −4.89217E−05 8.10136E−034.31012E−02 H(18th)/C11 0.00000E+00  0.00000E+00 −7.44946E−04 −4.76448E−03  J(20th)/C12 0.00000E+00  0.00000E+00 0.00000E+000.00000E+00

TABLE 13 Lens Surface (Surf) S6* S7* S8* S9* Radius −4.25861E+00 −1.66696E+00 −1.76751E+00 −4.13991E+00 K(Conic) −3.54859E+01  1.07597E−02 −1.14768E+01 −1.62287E+00 A(4th)/C4 9.73396E−02 4.31057E−01  6.76674E−02 −1.20789E−02 B(6th)/C5 −3.06865E−01 −3.53551E−01  4.28382E−01  2.74527E−01 C(8th)/C6 5.45067E−01−1.27186E+00 −2.83510E+00 −8.86537E−01 D(10th)/C7 −5.16128E−01  4.85328E+00  7.09720E+00  1.64961E+00 E(12th)/C8 2.71914E−01−7.23925E+00 −9.50850E+00 −1.88424E+00 F(14th)/C9 −7.42660E−02  5.84400E+00  7.40401E+00  1.33871E+00 G(16th)/C10 8.14168E−03−2.67247E+00 −3.35737E+00 −5.74932E−01 H(18th)/C11 0.00000E+00 6.51585E−01  8.22811E−01  1.36345E−01 J(20th)/C12 0.00000E+00−6.58923E−02 −8.43020E−02 −1.36861E−02

FIG. 25 is a view illustrating a lens assembly (e.g., the camera module180, 205, 212, or 213 in FIGS. 1 to 3 or the lens assembly 500 in FIG. 6) according to an embodiment of the disclosure.

FIG. 26 is a graph showing spherical aberration of the lens assembly ofFIG. 25 according to an embodiment of the disclosure.

FIG. 27 is a graph showing astigmatism of the lens assembly of FIG. 25according to an embodiment of the disclosure.

FIG. 28 is a graph showing distortion rate of the lens assembly of FIG.25 according to an embodiment of the disclosure.

Referring to FIGS. 25 to 28 , a lens assembly 1000 may have a focallength of about 9.68 mm, an F-number of 2.847, a total track length of2.587 mm, an image height of 2.28 mm, and/or a field of view of 26.39degrees. The total track length may be understood as, for example, thedistance from the object-side surface S2 of the first lens L1 to thesensor-side surface S9 of the fourth lens L4, and the image height isthe maximum distance from the optical axis O3 to the edge of the imagingsurface (img), and may be understood, for example, as half of thediagonal length of the imaging surface (img). The lens assembly 1000 maybe manufactured with the specifications exemplified in the followingTable 14 while satisfying at least some of the conditions presentedthrough the above-described equations, and the aspherical surfacecoefficients of Tables 15 and 16.

TABLE 14 Effective Lens Radius of Focal Refractive Abbe SurfaceCurvature Thickness Length Index Number Refraction (Surf) (Radius)(Thick) (EFL) (nd) (vd) Mode obj infinity infinity S1 infinity 0.00000S2*(sto) 4.81438 0.66890 6.322 1.53480 55.71 refraction S3* −10.963590.05000 refraction S4* 1.88189 0.30999 −20.242 1.63491 23.98 refractionS5* 1.53779 0.08692 refraction S6* 1.79756 0.30000 −5.347 1.63915 23.52refraction S7* 1.10464 0.54671 refraction S8* 3.66400 0.62402 6.2771.56717 37.4 refraction S9* −151.66280 0.50000 refraction S10 infinity1.25000 refraction S11 infinity −1.25000 total internal reflection S12infinity −0.40000 refraction S13 infinity −2.20000 infinity −1.5168064.17 refraction S14 infinity 2.00000 infinity 1.51680 64.17 totalinternal reflection S15 infinity −1.00000 infinity −1.51680 64.17reflection S16 infinity 0 refraction S17 infinity 0 refraction S18infinity −0.29628 refraction img infinity −0.0145 refraction

TABLE 15 Lens Surfaces (Surf) S2* S3* S4* S5* Radius 4.81438E+00−1.09636E+01  1.88189E+00  1.53779E+00 K(Conic) 3.54569E+00 −8.81750E+01−1.11753E+00 −2.97857E+00 A(4th)/C4 1.10535E−02  3.75683E−02−6.77231E−02 −8.04691E−02 B(6th)/C5 −2.37619E−02   6.00630E−02 3.05337E−01  6.04620E−01 C(8th)/C6 5.51038E−02 −1.72126E−01−6.18872E−01 −1.59535E+00 D(10th)/C7 −7.31852E−02   1.93129E−01 6.59582E−01  2.32597E+00 E(12th)/C8 5.71269E−02 −1.21215E−01−4.20411E−01 −2.06428E+00 F(14th)/C9 −2.70837E−02   4.55352E−02 1.63641E−01  1.13397E+00 G(16th)/C10 7.67817E−03 −1.01392E−02−3.76324E−02 −3.75594E−01 H(18th)/C11 −1.20040E−03   1.22357E−03 4.60537E−03  6.86622E−02 J(20th)/C12 7.97410E−05 −6.04962E−05−2.21886E−04 −5.31537E−03

TABLE 16 Lens Surfaces (Surf) S6* S7* S8* S9* Radius  1.79756E+00 1.10464E+00 3.66400E+00 −1.51663E+02 K(Conic) −4.28944E+00 −6.17228E−01−1.33453E+01   9.90000E+01 A(4th)/C4 −1.20176E−02 −9.32545E−026.15451E−02  1.80431E−02 B(6th)/C5  1.11064E−01 −2.50681E−01−5.88048E−02  −4.91700E−03 C(8th)/C6 −5.07951E−01  6.81713E−016.94644E−02 −1.15032E−02 D(10th)/C7  1.04700E+00 −9.18078E−01−5.28833E−02   4.47342E−02 E(12th)/C8 −1.14248E+00  7.54505E−011.41760E−02 −6.67360E−02 F(14th)/C9  7.21138E−01 −3.83446E−011.25406E−02  5.43212E−02 G(16th)/C10 −2.65043E−01  1.14335E−01−1.25307E−02  −2.48871E−02 H(18th)/C11  5.27410E−02 −1.76176E−024.17500E−03  5.96954E−03 J(20th)/C12 −4.39872E−03  9.87459E−04−4.95931E−04  −5.77902E−04

FIG. 29 is a view illustrating a lens assembly 1100 (e.g., the cameramodule 180, 205, 212, or 213 in FIGS. 1 to 3 or the lens assembly 500 inFIG. 6 ) according to an embodiment of the disclosure.

FIG. 30 is a graph showing spherical aberration of the lens assembly1100 of FIG. 29 according to an embodiment of the disclosure.

FIG. 31 is a graph showing astigmatism of the lens assembly 1100 of FIG.29 according to an embodiment of the disclosure.

FIG. 32 is a graph showing distortion rate of the lens assembly 1100 ofFIG. 29 according to an embodiment of the disclosure.

Referring to FIGS. 29 to 32 , a lens assembly 1100 may have a focallength of about 16.79 mm, an F-number of 2.872, a total track length of3.700 mm, an image height of 2.8 mm, and/or a field of view of 18.79degrees. The total track length may be understood as, for example, thedistance from the object-side surface S2 of the first lens L1 to thesensor-side surface S9 of the fourth lens L4, and the image height isthe maximum distance from the optical axis O3 to the edge of the imagingsurface (img), and may be understood, for example, as half of thediagonal length of the imaging surface (img). The lens assembly 1100 maybe manufactured with the specifications exemplified in the followingTable 17 while satisfying at least some of the conditions presentedthrough the above-described equations, and the aspherical surfacecoefficients of Table 18.

TABLE 17 Effective Lens Radius of Focal Refractive Abbe SurfaceCurvature Thickness Length Index Number Refraction (Surf) (Radius)(Thick) (EFL) (nd) (vd) Mode obj infinity infinity S1 infinity 0.00000S2 4.46972 1.42806 6.981 1.74400 44.9 refraction S3 26.81334 0.16532refraction S4 11.69539 0.69575 −10.994 1.94593 17.98 refraction S55.38100 0.30000 refraction S6* 13.14997 0.65009 11.471 1.67074 19.24refraction S7* −18.71445 0.11079 refraction S8*(sto) −17.60577 0.35000−8.261 1.61444 25.94 refraction S9* 7.27892 1.50000 refraction S10infinity 1.80000 infinity 1.80610 40.73 refraction S11 infinity −1.80000infinity −1.80610 40.73 total internal reflection S12 infinity −0.40000refraction S13 infinity −3.60000 infinity −1.51680 64.17 refraction S14infinity 2.80000 infinity 1.51680 64.17 total internal reflection S15infinity −1.40000 infinity −1.51680 64.17 reflection S16 infinity−2.0044 refraction img infinity 0.0015 refraction

TABLE 18 Lens Surfaces (Surf) S6* S7* S8* S9* Radius 1.31500E+01−1.87144E+01  −1.76058E+01 7.27892E+00 K(Conic) 2.96540E+01 1.04376E+01−4.33088E−01 9.83118E+00 A(4th)/C4 1.71245E−03 −7.02775E−03 −2.27348E−02 −9.98966E−03  B(6th)/C5 −7.10760E−03  2.47936E−03 3.19183E−02 1.94378E−02 C(8th)/C6 7.93882E−03 6.54277E−03 −2.66369E−02−2.27085E−02  D(10th)/C7 −4.94674E−03  −8.03284E−03   1.42199E−021.59888E−02 E(12th)/C8 1.88412E−03 4.31713E−03 −5.21168E−03−7.26017E−03  F(14th)/C9 −4.55793E−04  −1.34264E−03   1.30264E−032.15560E−03 G(16th)/C10 6.87166E−05 2.53302E−04 −2.07019E−04−4.05645E−04  H(18th)/C11 −5.88568E−06  −2.70550E−05   1.83835E−054.38516E−05 J(20th)/C12 2.16835E−07 1.25311E−06 −6.80453E−07−2.07809E−06 

A lens assembly according to an embodiment of the disclosure (e.g., thecamera module 180, 205, 212, or 213 in FIGS. 1 to 3 , or the lensassembly 500, 600, 700, 800, 900, 1000, or 1100 in FIG. 6, 8, 13, 17, 21, or 25) may include an optical member (e.g., the optical members R1 andR2 in FIG. 8 ) that reflect and/or refract incident light, which maymake it possible to freely design a light traveling path leading to theimage sensor (e.g., the image sensor I in FIG. 8 ). For example, thearrangement direction of the imaging surface (e.g., the imaging surfaceimg in FIG. 8 ) of the image sensor I may be variously designed withrespect to the arrangement of lenses (e.g., lenses L1, L2, L3, and L4 inFIG. 8 ). Accordingly, it is easy to mount a lens assembly having highoptical performance in a downsized and lightened electronic device suchas a smartphone (e.g., the electronic device 101, 102, 104, 200, 300, or400 in FIGS. 1 to 6 ). In an embodiment, by disposing an additionaloptical member (e.g., the first refractive member 413 in FIG. 6 ) infront of the arrangement of lenses, it is possible to arrange lenses inthe length direction (e.g., the Y-axis direction in FIG. 5 ) and/or thewidth direction (e.g., the X-axis direction of FIG. 5 ) of theelectronic device. For example, in the number and arrangement of lenses,a degree of freedom in design may be enhanced in a downsized electronicdevice. In an embodiment, when lenses are arranged in the lengthdirection or the width direction of the electronic device, it may beeasy to secure a space for the forward and backward movement of thelenses in the direction of the optical axis (e.g., the first opticalaxis O1 in FIG. 8 ). For example, by securing an environment capable ofimplementing a focal length adjustment operation and/or a focusadjustment operation, it may be easy to improve optical performance(e.g., telephoto performance) of the lens assembly.

Effects that are capable of being obtained by the disclosure are notlimited to those described above, and other effects not described abovemay be clearly understood by a person ordinarily skilled in the art towhich the disclosure belongs based on the following description.

As described above, according to an embodiment of the disclosure, a lensassembly (e.g., the camera module 180, 205, 212, or 213 in FIGS. 1 to 3, or the lens assembly 500, 600, 700, 800, 900, 1000, or 1100 in FIGS.6, 8, 13, 17, 21, and 25 ) may include at least two lenses (e.g., thelenses L1, L2, L3, and L4 in FIGS. 8, 13, 17, 21 , and 25) arrangedalong the direction of a first optical axis (e.g., the optical axis O1in FIG. 8 ) from an object (e.g., the object OB in FIG. 8 ) side, animage sensor (e.g., the image sensor I in FIGS. 8, 13, 17, 21, and 25 )configured to receive light guided and/or focused through the at leasttwo lenses, wherein the image sensor includes an imaging surface (e.g.,the imaging surface img in FIG. 8 ) disposed to be inclined with respectto the first optical axis, a first optical member (e.g., the firstoptical member R1 in FIGS. 8, 13, 17, 21, and 25 ) disposed between theat least two lenses and the image sensor, wherein the first opticalmember is configured to receive light incident through the at least twolenses in a direction of the first optical axis and to emit the lightalong a direction of a second optical axis (e.g., the second opticalaxis O2 in FIG. 8 ) crossing the first optical axis, and a secondoptical member (e.g., the second optical member R2 in FIGS. 8, 13, 17,21, and 25 ) disposed between the first optical member and the imagesensor, wherein the second optical member is configured to receive lightincident through the first optical member in the direction of the secondoptical axis and to emit the light to the image sensor along thedirection of a third optical axis (e.g., the third optical axis O3 inFIG. 8 ) crossing the second optical axis. In an embodiment, the lensassembly may satisfy a conditional expression “0.1<=TTL/f<=0.35”,wherein “TTL” is a length from an object-side surface (e.g., the surfaceindicated by “S2” in FIG. 8 ) of the first lens (e.g., the first lens L1in FIGS. 8, 13, 17, 21, and 25 ) on the object side to a sensor-sidesurface S9 of the first lens (e.g., the fourth lens L4 in FIGS. 8, 13,17, 21 , and 25) on the image sensor side, and “f” is a focal length ofthe lens assembly. In an embodiment, the lens assembly may satisfy aconditional expression “15<=Ang-min<=40”, wherein “Ang-min” is thesmallest angle among angles formed by two adjacent surfaces (e.g.,adjacent two surfaces among the incidence surface F1, the emissionsurface F2, and/or the second reflection surface F3 in FIG. 9 ) of thesecond optical member.

According to another embodiment, the lens assembly described above maysatisfy a conditional expression “−2<=f1/f2<=−0.1”, wherein “f1” is thefocal length of the first lens on the object side, and “f2” is the focallength of the second lens on the object side (e.g., the second lens L2of FIGS. 8, 13, 17, 21, and 25 ).

According to another embodiment, the lens assembly described above maysatisfy a conditional expression “25<=Vd-1<=95,” wherein “Vd-1” is theAbbe number of the first lens on the object side.

According to another embodiment, the lens assembly described above maysatisfy a conditional expression “0.1<=t-L1/TTL<=0.5,” wherein “t-L1” isthe thickness of the first lens on the object side.

According to another embodiment, the lens assembly described above maysatisfy a conditional expression “5<=FoV<=35,” wherein “FoV” is thefield of view of the lens assembly.

According to another embodiment, the first optical member may include amirror and/or a prism, and the second optical member may include aprism.

According to another embodiment, the lens assembly described above maybe configured to execute focal length adjustment and/or focus adjustmentby moving at least one of the at least two lenses along the direction ofthe first optical axis.

According to another embodiment, the lens assembly described above maybe configured to execute optical image stabilization by moving at leastone of the at least two lenses in a plane perpendicular to the firstoptical axis.

According to another embodiment, the lens assembly described above maybe configured to execute optical image stabilization by rotating and/ortilting the first optical member with respect to the first optical axis.

According to another embodiment, the third optical axis may cross and/orbe parallel to the first optical axis.

According to another embodiment, the second optical member may includean incidence surface facing the first optical member (e.g., theincidence surface F1 in FIG. 9 ) and an emission surface facing theimage sensor (e.g., the emission surface F2 in FIG. 9 ), and between theincidence surface and the emission surface, the second optical member isconfigured to reflect and/or refract light incident on the incidencesurface, at least twice.

According to another embodiment, the lens assembly described above mayfurther include an infrared blocking layer (e.g., the infrared blockinglayer IFL in FIG. 9 ) disposed on at least one of the incidence surfaceand/or the emission surface.

According to another embodiment, the second optical member may furtherinclude a reflection surface (e.g., the second reflection surface F3 inFIG. 9 ) disposed to be inclined with respect to the emission surface,the emission surface and the reflection surface may be configured toreflect or refract light incident on the incidence surface inside thesecond optical member, and the light reflected and/or refracted at leasttwice inside the second optical member may be guided or emitted to theimage sensor through the emission surface.

According to another embodiment, among a first angle between theincidence surface and the emission surface (e.g., the first angle Ang-p1in FIG. 9 ), a second angle between the emission surface and thereflection surface (e.g., the second angle Ang-p2 in FIG. 9 ), and athird angle between the reflection surface and the incidence surface(e.g., the third angle Ang-p3 in FIG. 9 ), the second angle may be thesmallest and may be 15 degrees or more and 40 degrees or less.

According to another embodiment of the disclosure, an electronic device(e.g., the electronic device 101, 102, 104, 200, 300, or 400 of FIGS. 1to 6 ) may include a lens assembly (e.g., the camera module 180, 205,212, or 213 in FIGS. 1 to 3 , or the lens assembly 500, 600, 700, 800,900, 1000, or 1100 in FIGS. 6, 8, 13, 17, 21, and 25 ), and a processor(e.g., the processor 120 of FIG. 1 ) configured to acquire an image byreceiving external light by using the lens assembly. In anotherembodiment, the lens assembly may include at least two lenses (e.g., thelenses L1, L2, L3, and L4 in FIGS. 8, 13, 17, 21, and 25 ) arrangedalong the direction of a first optical axis (e.g., the first opticalaxis O1 in FIG. 8 ) from an object (e.g., the object OB in FIG. 8 )side, an image sensor (e.g., the image sensor I in FIGS. 8, 13, 17, 21,and 25 ) configured to receive light guided and/or focused through theat least two lenses, wherein the image sensor includes an imagingsurface (e.g., the imaging surface img in FIG. 8 ) disposed to beinclined with respect to the first optical axis, a first optical member(e.g., the first optical member R1 in FIGS. 8, 13, 17, 21, and 25 )disposed between the at least two lenses and the image sensor, whereinthe first optical member is configured to receive light incident throughthe at least two lenses in a direction of the first optical axis and toemit the light along a direction of a second optical axis (e.g., thesecond optical axis O2 in FIG. 8 ) crossing the first optical axis, anda second optical member (e.g., the second optical member R2 in FIGS. 8,13, 17, 21, and 25 ) disposed between the first optical member and theimage sensor, wherein the second optical member is configured to receivelight incident through the first optical member in the direction of thesecond optical axis and to emit the light to the image sensor along thedirection of a third optical axis (e.g., the third optical axis O3 inFIG. 8 ) crossing the second optical axis. In another embodiment, thelens assembly may satisfy a conditional expression “0.1<=TTL/f<=0.35”,wherein “TTL” is a length from an object-side surface (e.g., the surfaceindicated by “S2” in FIG. 8 ) of the first lens (e.g., the first lens L1in FIGS. 8, 13, 17, 21, and 25 ) on the object side to a sensor-sidesurface (e.g., the surface indicated by “S9” in FIG. 8 ) of the firstlens (e.g., the fourth lens L4 in FIGS. 13, 17, 21, and 25 ) on theimage sensor side, and “f” is a focal length of the lens assembly. Inanother embodiment, the lens assembly described above may satisfy aconditional expression “5<=FoV<=35,” wherein “FoV” is the field of viewof the lens assembly.

According to another embodiment, the second optical member may includean incidence surface facing the first optical member (e.g., theincidence surface F1 in FIG. 9 ), an emission surface facing the imagesensor (e.g., the emission surface F2 in FIG. 9 ), and a reflectionsurface (e.g., the second reflection surface F3 in FIG. 9 ) disposed tobe inclined with respect to the emission surface, and between theincidence surface and the emission surface, the second optical membermay be configured to reflect and/or refract light incident on theincidence surface, at least twice.

According to another embodiment, among a first angle between theincidence surface and the emission surface (e.g., the first angle Ang-p1in FIG. 9 ), a second angle between the emission surface and thereflection surface (e.g., the second angle Ang-p2 in FIG. 9 ), and athird angle between the reflection surface and the incidence surface(e.g., the third angle Ang-p3 in FIG. 9 ), the second angle may be thesmallest and may be 15 degrees or more and 40 degrees or less.

According to another embodiment, the lens assembly described above maysatisfy a conditional expression “−2<=f1/f2<=−0.1”, wherein “f1” is thefocal length of the first lens on the object side, and “f2” is the focallength of the second lens on the object side (e.g., the second lens L2of FIGS. 8, 13, 17, 21, and 25 ).

According to another embodiment, the lens assembly described above maysatisfy a conditional expression “25<=Vd-1<=95,” wherein “Vd-1” is theAbbe number of the first lens on the object side.

According to another embodiment, the lens assembly described above maysatisfy a conditional expression “0.1<=t-L1/TTL<=0.5,” wherein “t-L1” isthe thickness of the first lens on the object side.

While the disclosure has been shown and described with reference tovarious embodiments thereof, it will be understood by those skilled inthe art that various changes in form and details may be made thereinwithout departing from the spirit and scope of the disclosure as definedby the appended claims and their equivalents.

What is claimed is:
 1. A lens assembly comprising: at least two lensesarranged along a direction of a first optical axis from an object side;an image sensor configured to receive light guided or focused throughthe at least two lenses, wherein the image sensor comprises an imagingsurface disposed to be inclined with respect to the first optical axis;a first optical member disposed between the at least two lenses and theimage sensor, wherein the first optical member is configured to receivelight incident through the at least two lenses in the direction of thefirst optical axis and to emit the light along a direction of a secondoptical axis crossing the first optical axis; and a second opticalmember disposed between the first optical member and the image sensor,wherein the second optical member is configured to receive lightincident through the first optical member in the direction of the secondoptical axis and to emit the light to the image sensor along a directionof a third optical axis crossing the second optical axis, wherein thelens assembly satisfies at least one expression of:0.1<=TTL/f<=0.35; or15<=Ang-min<=40, wherein “TTL” is a length from an object-side surfaceof a first lens on the object side to a sensor-side surface of a firstlens on an image sensor side, wherein“f” is a focal length of the lensassembly, and wherein “Ang-min” is a smallest angle among angles formedby two adjacent surfaces of the second optical member.
 2. The lensassembly of claim 1, wherein the lens assembly further satisfies anexpression:−2<=f1/f2<=−0.1, wherein “f1” is a focal length of the first lens on theobject side, and wherein “f2” is a focal length of a second lens on theobject side.
 3. The lens assembly of claim 1, wherein the lens assemblyfurther satisfies an expression:25<=Vd-1<=95, and wherein “Vd-1” is an Abbe number of the first lens onthe object side.
 4. The lens assembly of claim 1, wherein the lensassembly further satisfies an expression:0.1<=t-L1/TTL<=0.5, and wherein “t-L1” is a thickness of the first lenson the object side.
 5. The lens assembly of claim 1, wherein the lensassembly further satisfies an expression:5<=FoV<=35, and wherein “FoV” is a field of view of the lens assembly.6. The lens assembly of claim 1, wherein the first optical membercomprises a mirror or a prism, and wherein the second optical membercomprises a prism.
 7. The lens assembly of claim 1, wherein the lensassembly is configured to execute focal length adjustment or focusadjustment by moving at least one of the at least two lenses along thedirection of the first optical axis.
 8. The lens assembly of claim 1,wherein the lens assembly is configured to execute optical imagestabilization by moving at least one of the at least two lenses in aplane perpendicular to the first optical axis.
 9. The lens assembly ofclaim 1, wherein the lens assembly is configured to execute opticalimage stabilization by rotating or tilting the first optical member withrespect to the first optical axis.
 10. The lens assembly of claim 1,wherein the third optical axis crosses or is parallel to the firstoptical axis.
 11. The lens assembly of claim 1, wherein the secondoptical member comprises an incidence surface facing the first opticalmember and an emission surface facing the image sensor, and wherein,between the incidence surface and the emission surface, the secondoptical member is configured to reflect or refract light incident on theincidence surface, at least twice.
 12. The lens assembly of claim 11,further comprising an infrared blocking layer disposed on at least oneof the incidence surface or the emission surface.
 13. The lens assemblyof claim 11, wherein the second optical member further comprises areflection surface disposed to be inclined with respect to the emissionsurface, wherein the emission surface and the reflection surface areconfigured to reflect or refract light incident on the incidence surfaceinside the second optical member, and wherein the light reflected orrefracted at least twice inside the second optical member is guided oremitted to the image sensor through the emission surface.
 14. The lensassembly of claim 13, wherein, among a first angle between the incidencesurface and the emission surface, a second angle between the emissionsurface and the reflection surface, and a third angle between thereflection surface and the incidence surface, the second angle issmallest and is 15 degrees or more and 40 degrees or less.
 15. Anelectronic device comprising: a lens assembly; and at least oneprocessor configured to acquire an image by receiving external light byusing the lens assembly, wherein the lens assembly comprises: at leasttwo lenses arranged along a direction of a first optical axis from anobject side; an image sensor configured to receive at least one lightguided or light focused through the at least two lenses, wherein theimage sensor comprises an imaging surface disposed to be inclined withrespect to the first optical axis; a first optical member disposedbetween the at least two lenses and the image sensor, wherein the firstoptical member is configured to receive light incident through the atleast two lenses in the direction of the first optical axis and to emitthe light along a direction of a second optical axis crossing the firstoptical axis; and a second optical member disposed between the firstoptical member and the image sensor, wherein the second optical memberis configured to receive light incident through the first optical memberin the direction of the second optical axis and to emit the light to theimage sensor along a direction of a third optical axis crossing thesecond optical axis, wherein the lens assembly satisfies at least oneexpression of:0.1<=TTL/f<=0.35, or5<=FoV<=35, wherein “TTL” is a length from an object-side surface of afirst lens on an object side to a sensor-side surface of a first lens onan image sensor side, and wherein “FoV” is a field of view of the lensassembly.
 16. The electronic device of claim 15, wherein the secondoptical member comprises an incidence surface facing the first opticalmember, an emission surface facing the image sensor, and a reflectionsurface disposed to be inclined with respect to the emission surface,and wherein, between the incidence surface and the emission surface, thesecond optical member is configured to reflect or refract light incidenton the incidence surface, at least twice.
 17. The electronic device ofclaim 16, wherein, among a first angle between the incidence surface andthe emission surface, a second angle between the emission surface andthe reflection surface, and a third angle between the reflection surfaceand the incidence surface, the second angle is smallest and is 15degrees or more and 40 degrees or less.
 18. The electronic device ofclaim 15, wherein the lens assembly further satisfies an expression:−2<=f1/f2<=−0.1, wherein “f1” is a focal length of the first lens on theobject side, and wherein “f2” is a focal length of a second lens on theobject side.
 19. The electronic device of claim 15, wherein the lensassembly further satisfies an expression:25<=Vd-1<=95, and wherein “Vd-1” is an Abbe number of the first lens onthe object side.
 20. The electronic device of claim 15, wherein the lensassembly further satisfies an expression:0.1<=t-L1/TTL<=0.5, and wherein “t-L1” is a thickness of the first lenson the object side.